Division Milestones

2000s | 1990s | 1980s | 1960s
2008	XCede® named DesignVision Award winner in the Interconnect and Component Technology category from the International Engineering Consortium (IEC) for innovative products and services that support the work of electronic design engineers
2007	XCede® Connector Platform from Amphenol TCS - Designed to Support 20+ Gbps Performance
2006	Amphenol Crossbow Connector Wins 2006 Design Vision Award at DesignCon 2006 - Interconnect Technologies and Components
2006	Amphenol TCS Launches Crossbow™ Connector Family
2005	Acquisition of Connection Systems Division of Teradyne, Inc. Reported by Amphenol Corporation
2005	Teradyne Connection Systems Provides Highest Density and Speed with Introduction of Ventura™ Connector; Robust SMT Design Leads Industry in Density and Speed
2005	Teradyne Connection Systems Introduces the GbX® E-Series Connector; Extends Product Family with Enhanced Electrical Performance
2005	Teradyne Connection Systems Introduces 2-Pair Version of GbX Connector Platform
2005	Teradyne Connection Systems Introduces the Aptera™ Low-Profile Connector
2004	Lucent Technologies Honors Teradyne with Golden Link Award
2004	Frost & Sullivan awarded TCS's High Performance Circuits group with the 2004 Customer Value Enhancement Award for its accomplishments in the Printed Circuit Board maufacturing and fabrication market
2004	Teradyne builds a 24" x 36" backplane containing 127,000 plated through holes
2004	Teradyne Connection Systems Introduces the GbX® L-Series Connector
2004	Teradyne Introduces HD-Optyx Connector - Industry’s First Modular Optical Interconnect Architecture
2004	Teradyne Introduces VHDM H-Series Connector To Meet Demand for OEM Platform Upgrade Solutions
2004	Teradyne High Performance Circuits Manufacturing Facility Achieves ISO 14001 Certifications
2003	Teradyne receives 2003 Golden Link Award from Lucent Technologies. Awards are based on a number of factors including: quality, timeliness of delivery, technology, innovation and overall value.
2003	Teradyne Introduces VHDM 8-Row Right-Angle Male Connector
2003	Teradyne Connection Systems (TCS), receives 2003 Service Excellence Award at APEX as the overall winner in the Electronics Manufacturing Services category for medium-sized companies (revenues between $100 and $500 million.)
2003	Teradyne Expands Presence in China and Opens Shanghai Facility
2003	Teradyne Connection Systems Offers Deep Micro-Via Solutions; Extends Technology Lead with Large Format High-Performance Circuits
2003	Teradyne Connection Systems Introduces the VHDM® L-Series Connector; Provides Cost-Performance Optimized Solution
2002	Teradyne Connection Systems Achieves ISO 14001 Certifications; International Environmental Management System Standard Awarded to Nashua, New Hampshire and Cavan, Ireland Facilities
2002	Teradyne Receives Service Excellence Awards at APEX; Customers Give High Marks for Electronics Assembly Equipment and Electronic Manufacturing Services
2002	GbX named as a Product of the Year by 'Electronic Products' Magazine
2001	Teradyne Connection Systems Receives "Transformation Supplier of the Year" Award from Cisco Systems
2001	Teradyne's NexLevT High-Speed Parallel Board-to-Board Connector Achieves Telcordia GR-1217-CORE Compliance
2001	Teradyne EMS Speeds Products to Market with Total Design for Manufacturability(DFM) Solutions
2001	Teradyne Connection Systems builds the world's largest backplane, a 24" x 54" 42 layer Nelco 600 board with 46,972 plated through holes for VHDM® connector attachment.
2001	Teradyne Connection Systems introduces VHDM® 6-Row Stacking Interconnect; high-speed, high-density parallel board connector expands VHDM® Product Family
2001	Teradyne Connection System introduces 6-row Differential-Pair Version of VHDM® Interconnect VHDM-HSDT
2001	Teradyne Connection Systems introduces GbX® Platform Connector
2000	Teradyne Connection Systems expands Circuits Operation with the acquisition of Herco Technologies and Synthane-Taylor based in Southern California
2000	Teradyne Connection Systems adds significant manufacturing capacity with addition of new facilities in Hudson, New Hampshire and Fremont, California.
2000	Teradyne Connection System introduces VHDM Right-Angle Male 6-Row allowing designers to grow their system horizontally by creating traditional backplane components in a right-angle orientation
2000	Teradyne Connection Systems introduces a new parallel board-to-board connector called NeXLev®
2000	Teradyne Connection System introduces 5-row Differential-Pair Version of VHDM® Interconnect VHDM-HSDT
1999	Teradyne Connection Systems introduces the high-speed differential version of VHDM® (VHDM-HSDT)
1998	Teradyne Connection Systems expands Circuits Operation
1997	Teradyne Connection Systems introduces the VHDM® high-speed/high-density board-to-backplane interconnect
1996	Teradyne Connection Systems build the world's largest backplane, a 29" x 27" 34-layer impedance controlled board with over 39,000 plated-through holes for connector attachment. The backplane is used in an advanced airborne radar system.
1996	Teradyne Connection Systems expands Nashua, New Hampshire factory to 400,000 square feet.
1996	Teradyne Connection Systems introduces the HDM Stacking Connector.
1993	Teradyne Connection Systems introduces HDM/HDM+
1992	Teradyne Connection Systems introduces Ultra-High Density (UHD) interconnect for advanced military/aerospace applications. UHD is qualified for use in space.
1989	Teradyne Connection Systems introduces HD+ 80
1985	Teradyne Connection Systems develops HD+1
1984	Teradyne Connection Systems develops High Density Plus board-to-backplane interconnect for high-speed/high-density commercial applications.
1980	Teradyne Connection Systems moves headquarters to new 240,000 square foot plant in Nashua, New Hampshire.
1968	Teradyne Components (now Teradyne Connection Systems) founded in Lowell, MA, to develop backplane assemblies and connectors