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Home > About ATCS > Quick Facts
  
Total Connection Systems
 
Amphenol TCS Headquarters in Nashua, NH
ATCS Headquarters
Quick Facts

Amphenol TCS (ATCS), a division of Amphenol Corporation (NYSE: APH), is the leader
in high performance connection systems, designing and manufacturing backplane systems, printed circuit boards and the industry's leading high-speed, high-density connectors. ATCS solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, computer server, and military/aerospace markets.

Founded
.................. 1968 (as a division of Teradyne, Inc.)
Acquired by Amphenol Corp.
.................. December 1, 2005
Headquarters
.................. 44 Simon Street
Nashua, New Hampshire 03060 USA
Stock Listing
.................. NYSE: APH
Employees
.................. Approximately 2,500
President
.................. Richard E. Schneider
2007 Sales
.................. $447 Million
Global Manufacturing
..................

Mexicali, Mexico
Penang, Malaysia
Chengdu, China
Changzhou, China
Shenzhen, China
Milpitas, California
Nashua, New Hampshire
Winston-Salem, North Carolina

Web Site
.................. www.amphenol-tcs.com
Products
..................

Backplane Systems
Integrated solutions that meet increasing bandwidth needs by optimizing the entire signal transmission path and boosting channel performance. Amphenol TCS is the world’s most advanced backplane manufacturer with a wide range of press fit, surface mount and test capabilities.

Connectors
Industry leading technology and the most reliable high-density solutions available for backplane, mezzanine and optical applications. Product families include: XCede®, Crossbow™ , GbX®, VHDM®, VHDM-HSD™, NeXLev®, HD-Optyx™, Aptera™, and Ventura®

High-Technology Printed Circuits
High-technology, high-reliability manufacturing located in North America with cost-effective global sourcing for high-volume productions. Our capabilities include: advanced materials, deep microvias, buried, blind and backdrilled vias, sequential lamination, panel sizes up to 24" x 54", layer counts up to 64, and board thicknesses up to .500".


 

 

     
   
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Aptera, Crossbow, eHSD, GbX, HD Plus, HDM Plus, HDM, HD-Optyx, NeXLev, Ventura, VHDM, VHDM-HSD, XCede, Amphenol DesignLink, DesignLink and Amphenol are trademarks or registered trademarks of Amphenol Corporation.
All other product names are the marks of the respective owners.