Press Release:

Teradyne Introduces 5-Row Differential-Pair Version of VHDM Interconnect

NASHUA, NH, January 26, 2000 -- In a continuing effort to offer functionally differentiated products, Teradyne Connection Systems has introduced a new 5-row version of its VHDM-HSD (High-Speed-Differential) interconnect. The connector features two pairs of signal contacts centered around a single ground plane and is designed to optimize high-speed performance at very fast risetimes. The 5-row VHDM-HSD thus becomes the latest platform related to the VHDM connector, which includes 6-row and 8-row single-ended designs, as well as an 8-row VHDM-HSD differential-pair design. The VHDM family gives system designers a wide degree of latitude in optimizing both speed and density. The single-ended versions of VHDM are suited for applications that demand high interconnect density at high speeds, while the differential-pair (HSD) versions of VHDM are optimized for balanced line applications and PWB routing.

Systems demanding high-speed performance and a slot pitch of 15mm will benefit from the VHDM-HSD 5-row configuration. Achieving high speeds while maintaining low cross-talk levels typically requires 100-ohm differential rather than 50-ohm single-ended connector architectures. VHDM-HSD is particularly well suited for high-speed systems using the new 2.5Gb/s device families. Some differential connectors on the market today use radical design techniques relatively unproven in real-world applications. By comparison, 5-row VHDM-HSD minimizes cross-talk levels to less than 3.5% while using more traditional, robust design approaches that don't compromise mechanical integrity.

The 5-row VHDM-HSD connector system is priced at approximately 18¢ per mated signal contact pair in full OEM production volumes.

Other factors impacting electrical interconnect performance include the spacing of the connector's contact pairs and the layout of the PWB hole patterns. 5-row VHDM-HSD daughterboard connectors are constructed using Teradyne's unique 'wafer' architecture. The wafers are designed with 'close-coupled' pairs for optimized pair spacing through both halves of the connector assembly. This helps minimize the 'in-pair' skew. Stripline shielding integrated into the connector design further improves overall electrical performance and isolation of the contact pairs.

About Teradyne
Teradyne is the world's largest manufacturer of automatic test equipment (ATE) for the electronics industry. Products include systems to test semiconductor devices, printed circuit assemblies, telephone lines, computerized telephone systems, Internet and Intranet networks, and software. The company’s Connection Systems Division is also a leading manufacturer of high-performance interconnects, backplane assemblies, and electromechanical subassemblies used in the production of telecom and Internet equipment. Based in Nashua, New Hampshire, Teradyne Connection Systems also supports customers from regional production facilities in Plano, TX; Milpitas and Fremont, CA; Dublin, Ireland; Mexicali, Mexico, and Grenada.