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Home > About TCS > News
 

Press Release:

Product Derivatives Introduced for VHDM Interconnect Family

NASHUA, NH, July 3, 2000 -- Teradyne's highly successful VHDM (Very High Density Metric) board-to-backplane interconnect system now includes two notable 6-row product derivatives: a right-angle male version of the daughterboard connector, and a new external bus-bar power distribution system.

Introduced in 1997, VHDM is a high pin-count interconnect system designed for high-density/high-speed data processing/storage, telecom, and datacom applications. The connector family is separated into two distinct platforms: six-row and eight-row configurations. In the eight-row version, VHDM provides 101 real signal pins per standard unit (linear inch). This is achieved by the use of stripline shielding, which permits all of the contacts to be used for signal transmission.

The new derivatives announced today are market-driven enhancements to the six-row version of VHDM. The right-angle male interconnect allows designers to grow their system horizontally by creating traditional backplane components in a right-angle orientation. Applications for the right-angle male include cable I/O interfacing directly to the edge of the daughtercard, (commonly seen in telecom systems), planar (daughtercard-to-daughtercard) extender-card applications, and straight I/O into the right-angle female VHDM connector. Since VHDM is based upon a modular 'waferized' architecture, the right-angle male wafers can be combined with power and guidance wafers to achieve an overall connector length of up to 304mm.

The second VHDM six-row product derivative is the addition of an external backplane power busing solution ideal for high-power applications. Power distribution is typically handled by internal PWB layers. However, this system is ideal for applications where high-current distribution is required. Heavy-duty aluminum, copper, or brass bus bars are mounted to the top or bottom surface of the backplane. The bars are populated with special power blades (two per slot) that mate with corresponding tri-beam power connectors located on the daughterboard-half of the interconnect. The daughterboard power connectors are protected by high-temperature plastic shrouds to prevent accidental contact to the live blades. Each power contact can handle 20A; the bulk resistance through the interface is 0.65m-ohm max.

About Teradyne
Teradyne is the world's largest manufacturer of automatic test equipment (ATE) for the electronics industry. Products include systems to test semiconductor devices, printed circuit assemblies, telephone lines, computerized telephone systems, Internet and Intranet networks, and software. The company’s Connection Systems Division is also a leading manufacturer of high-performance interconnects, backplane assemblies, and electromechanical subassemblies used in the production of telecom and Internet equipment. Based in Nashua, New Hampshire, Teradyne Connection Systems also supports customers from regional production facilities in Plano, TX; Milpitas and Fremont, CA; Dublin, Ireland; Mexicali, Mexico, and Grenada.

 

     
   
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