Nashua, NH - Jan. 29, 2001 -- Teradyne Connection Systems (NYSE: TER), a leading manufacturer of high-speed/high-density interconnects, multi-gigabit custom backplanes, and high-performance systems integration today announced its GbX(TM) platform connector.

Teradyne's GbX connector offers an upgrade path beyond the company's industry-leading VHDM and VHDM-HSD platforms, with a 45 percent increase in signal pin density to 55 differential pairs per linear inch. A high-density configuration offering 73 pairs per linear inch also is planned. In addition, the GbX connector delivers a broader performance range; exceptional impedance matching reduces reflections, and a unique twin-axial structure minimizes crosstalk to support data rates up to 10 Gb/s.

"While GbX is an excellent high density connector for systems running 2.5 Gb/s data rates, the real advantage is the ability to support faster system speeds as devices become available," said Peter Traver, GbX project leader, Teradyne Connection Systems. "Teradyne is working with a number of customers and device manufacturers to achieve 10 Gb/s solutions in copper; this is where we expect the connector to really shine."

In addition to increased density and speed, the GbX connector features a newly-designed power module which offers multi-stage sequencing and supports hot plug applications. A grounding feature designed into the guidance system offers a useful space-saving option for achieving chassis ground - a feature often key to meeting EMI specifications. The modularity of the product offers the designer an easy way to customize the interconnect to a specific application.

"GbX is a low-risk choice, using today's proven technology such as press fit-attach, and dual points of contact at the separable interface," said Traver. "As a platform connector, GbX will offer the same design flexibility that customers have come to expect from Teradyne."
The GbX delivers excellent electrical performance and provides enhanced signal integrity with 100 Ohm matched differential impedance for reduced reflections. The twin-axial structure in the mating area provides added shielding, offering better crosstalk control at fast rise times.

Availability

The GbX platform connector will be available for evaluation and prototyping in Q2 2001. Volume manufacturing is scheduled to be in place for Q4 2001.
Teradyne will demonstrate GbX performance Jan. 30-31 at the International Engineering Consortium's (IEC) DesignCon 2001 conference; Santa Clara Convention Center, Santa Clara, Calif.

About Teradyne Connection Systems

Teradyne Connection Systems (TCS), a division of Teradyne, Inc., is a leading manufacturer of high-performance custom backplanes, high-speed/high-density interconnects, and complete electro-mechanical packaging subassemblies. TCS employs more than 3,000 people at its New Hampshire production facilities and nearly 5,000 worldwide.
http://www.teradyne.com/tcs

About Teradyne:

Founded in 1960, Teradyne, Inc. (NYSE: TER) is the world's largest supplier of automatic test equipment and software for the telecommunications and electronics industries, and a leading supplier of high-performance backplane assemblies and connectors. More than 70% of Teradyne's business is driven by the Internet growth, with 2000 sales reaching $3 billion.
http://www.teradyne.com