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Press Release:
Teradyne Connection Systems Introduces VHDM 6-row Stacking
Interconnect; High-Speed, High-Density Parallel Board Connector
Expands VHDM Product Family
NASHUA, N.H. April 25, 2001 -- Teradyne
Connection Systems (NYSE: TER), a leading manufacturer of
high-speed/high-density interconnects, multi-gigabit custom
backplanes, and high-performance systems integration today
announced its latest interconnect product, the VHDM(TM) 6-row
Stacking Connector. The connector expands on Teradyne's leading
VHDM wafer technology and provides a press-fit solution for
stacking applications such as Daughter-card-to-Backplane and
Daughtercard-to-Grand-daughtercard.
Teradyne's VHDM(TM) 6-row Stacking Connector
is based on a 2 mm x 2.25 mm grid that is designed to mate
with standard VHDM 6-row backplane modules. It allows for
the design of parallel board-to-board connections with the
high-speed, high-density performance of VHDM, including 76
real signal pins per inch, strip-line shielding, and cross-talk
less than 5 percent. Introduced in 18 mm and 28 mm stack heights,
the new connector is capable of easily migrating to heights
between 16 mm and 30 mm.
"The VHDM 6-row Stacking Connector is the
perfect solution for designers looking to meet parallel board
interconnection applications with a high speed, high density
press-fit connector," said Richard Humphrey, VHDM product
manager, Teradyne Connection Systems.
The connector features VHDM's proven wafer
technology. Wafers are loaded into plastic housings that can
accommodate 10 and 25 positions and can be custom configured
by exchanging signal wafers with power or spacer wafers to
provide added design flexibility. The plastic housings are
end-stackable and designed with end-walls that facilitate
mating of the backplane modules.
Pricing and Availability
Teradyne's VHDM(TM) 6-row Stacking Connector is priced at
approximately $.20 - $.24 per mated signal line in full production
volumes and is available immediately.
About Teradyne's VHDM(TM) Product Family
VHDM(TM) is a board-to-board interconnect system designed
for high-density/high-speed data processing/storage, telecom,
and datacom applications. The connector family continues to
expand and currently is available in 6-row and 8-row single-ended
versions; 5-row, 6-row, and 8-row high-speed differential
(HSD) versions; a 6-row Stacking Connector that accommodates
parallel board stacking applications; and a 6-row Right Angle
Male version that accommodates co-planar applications. The
VHDM and the VHDM-HSD(TM) connectors provide designers with
the flexibility to scale their performance and density needs
within a common connector platform. In addition to this expansion
in the core product, VHDM continues to add options such as
coax and grounded guide modules that can be integrated into
the connector configuration for further design flexibility.
About Teradyne Connection Systems
Teradyne Connection Systems (TCS), a division of Teradyne,
Inc., is a leading manufacturer of high-performance custom
backplanes, high-speed/high-density interconnects, and complete
electro-mechanical packaging subassemblies. TCS employs more
than 3,000 people at its New Hampshire production facilities
and nearly 5,000 worldwide.
About Teradyne Inc.
Founded in 1960, Teradyne, Inc. (NYSE: TER) is the world's
largest supplier of automatic test equipment and software
for the telecommunications and electronics industries, and
a leading supplier of high-performance backplane assemblies
and connectors. More than 70 percent of Teradyne's business
is driven by the Internet growth, with 2000 sales of $3 billion.
http://www.teradyne.com
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