Less than 2% Crosstalk and More Density Provide Ideal
Solution for XAUI Applications
NASHUA, N.H.--Jan. 29, 2002-- Teradyne,
Inc. (NYSE: TER) Connection Systems Division (TCS),
a leading manufacturer of high-speed/high-density interconnect,
printed circuit backplanes, and high-performance systems
integration and test today announced the release of
its GbX(TM) platform connector for general availability.
Teradyne's GbX connector offers an
upgrade path beyond existing 2mm platforms and delivers
the highest level of density available today. GbX balances
mechanical robustness and higher signal integrity to
deliver an effective 10 Gb/s Ethernet interconnect,
especially where high-density is required, with less
than 2% crosstalk.
"As existing 2 mm connector platforms
run out of steam, OEM designers will be looking for
the best balance between mechanical packaging and signal
integrity," said Peter Traver, GbX project leader,
Teradyne Connection Systems. "GbX makes the right
tradeoffs and ends up as the high-performance, low risk
solution."
The GbX connector is ideal for 10
Gb/s (4 x 3.125 Gb/s) XAUI data rates, with four high-speed
pairs per wafer, ease of routability, reduced capacitance
via structure, low cross talk and high performance.
At 3.125Gb/s, the GbX connector offers exceptional performance
with a significant amount of headroom for faster data
rates.
The GbX 4-pair platform offers 55
differential pairs per linear inch, while the 5-pair
configuration offers 69 differential pairs per linear
inch. With 55 pairs per linear inch, GbX allows for
the most XAUI links in the industry today.
The GbX connector delivers excellent
electrical performance and provides enhanced signal
integrity with 100 Ohm matched differential impedance
for reduced reflections. The twin-axial structure in
the mating area provides added shielding, offering better
crosstalk control at fast rise times.
Pricing and Availability
The GbX platform connector is priced
at approximately $.20 - $.28 per mated signal line in
full production volumes and is available immediately.
Demonstrations
Teradyne will demonstrate GbX performance
Jan. 29-30 at the International Engineering Consortium's
(IEC) DesignCon 2002 conference; Santa Clara Convention
Center, Santa Clara, Calif.; booth #509.
About Teradyne Connection
Systems Division
Teradyne Connection Systems (TCS), a division of Boston-based
Teradyne, Inc., provides high performance system solutions
to industry leading OEMs, with printed circuit boards,
high-speed, high-density connectors, multi-gigabit backplane
assemblies and complete systems integration and test.
Teradyne's high-technology components and electronic
manufacturing services are used by manufacturers of
communications and computing systems central to building
networking infrastructure. For more information visit
http://www.teradyne.com/tcs.
About Teradyne Inc.
Teradyne (NYSE: TER) is the world's largest supplier
of automatic test equipment and is also a leading supplier
of high performance interconnection systems and electronic
manufacturing services. Teradyne's test products are
used by manufacturers of semiconductors, circuit assemblies,
voice and broadband telephone networks. Teradyne's high
performance components and electronic manufacturing
services are used by manufacturers of communications
and computing systems central to building networking
infrastructure. The company had sales of $1.4 billion
in 2001 and currently employs about 8000 people worldwide.
For more information visit http://www.teradyne.com.
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