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Based on Real Life
Applications and More than 2 Billion Pins Installed,
DFM Guideline Improves Quality and Speed to Market
for High Volume Applications
Nashua, NH – April 29, 2002
– Teradyne, Inc. (NYSE:TER) Connection Systems
Division (TCS), a global supplier of high-performance
connectors, multi-gigabit backplanes, and systems integration
and test, today announced DFM Guidelines for its VHDM
and VHDM-HSD connector platforms. TCS’s DFM Guidelines
are unique in offering a detailed level of design assistance
based on real life applications and volume manufacturing
expertise.
The extended VHDM product family has effectively become
the industry standard for high-speed backplane connectors,
with measured system performance of 5 Gb/s and higher
and more than two billion pins installed since first
introduced in 1997. This added design support for the
connectors compliments the face-to-face design work
performed by TCS's Field Applications Engineers for
customers to help produce the best design on the first
pass.
"Teradyne’s application engineering team provides
essential DFM support, helping us determine optimal
connector configurations and keying systems," commented
Joel Appelbaum, Manufacturing Engineering Manager, Equipe
Communications. "As a result we have had no assembly
issues with VHDM and VHDM-HSD and the connectors have
proven reliable through hundreds of insertions on our
chassis."
Teradyne’s DFM Guideline for the VHDM and VHDM-HSD
connector platforms includes daughtercard and backplane
considerations, recommendations for guidance and keying,
power issues, and other specific information to improve
reliability. The DFM Guideline also addresses complex
design issues such as very long connectors with hundreds
of signals and heavy daughtercards.
"The Connector DFM Guidelines are the culmination
of lessons learned during the more than four years of
applications experience with VHDM and VHDM-HSD,"
said Jack Gullage, Teradyne’s Applications Engineering
Manager. "Applying this DFM tool to the system
design -- both electrical and mechanical -- early in
the process can help improve robustness and reduce defects
during volume manufacturing, which translates into significant
cost savings as well as reduced time-to-market for our
customers."
Teradyne also offers a DFM Guideline for Backplane Assembly
and plans to release additional DFM tools on printed
circuit board fabrication later this year. To request
a copy of Teradyne’s DFM Guideline for VHDM and
VHDM-HSD or Backplane Assembly, visit www.teradyne.com/dfm.
About Teradyne Connection Systems
Division
Teradyne Connection Systems (TCS), a division of Boston-based
Teradyne, Inc., provides high performance system solutions
to industry leading OEMs, with printed circuit boards,
high-speed, high-density connectors, multi-gigabit backplane
assemblies and complete systems integration and test.
Teradyne's high-technology components and electronic
manufacturing services are used by manufacturers of
communications and computing systems central to building
networking infrastructure. For more information visit
www.teradyne.com/tcs.
About Teradyne Inc.
Teradyne (NYSE: TER) is the world's largest supplier
of automatic test equipment and is also a leading supplier
of high performance interconnection products and total
systems integration services. Teradyne's automatic test
products are used by manufacturers of semiconductors,
circuit assemblies and voice and broadband telephone
networks. The company had sales of $3 billion in 2000
and currently employs about 8000 people worldwide. For
more information visit www.teradyne.com.
Teradyne Contact:
Catherine Palmer
Teradyne Connection Systems Division
Tel: 603-879-3600
palmer.cathy@teradyne.com
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