ATLANTA--(BUSINESS WIRE)--June 4, 2002--Vitesse Semiconductor Corporation (Nasdaq:VTSS) today announced that it is demonstrating a reference platform for networking OEMs who develop routers and multi-service switch solutions for telecom, datacom and SAN applications.

This reference platform enables network engineers to address the complex design challenges faced at high capacity bandwidths (up to 640Gb/s) in Metro and Core networks. The reference platform utilizes the Vitesse TeraStream(R) Intelligent Switch Fabric and is being showcased during SUPERCOMM in Atlanta, GA, June 4-6, 2002 (Booth #23976).

Vitesse partnered with Teradyne Inc. (NYSE:TER), Connection Systems Division and North East Systems Associates, Inc. (NESA) to develop this working chassis which includes power, thermal, chassis, backplane and interconnect. Teradyne's GbX(TM) connectors and high-speed backplanes are high density and have the ability to deliver greater than 6.5Gb/s data rates in a real world environment across conventional copper backplanes. Coupled with Vitesse's high-capacity TeraStream switch fabric, the reference platform is currently capable of supporting a fully redundant 160Gb/s of full-duplex user throughput. This system will also support the Vitesse GigaStream(TM) family (80Gb/s, OC-48) as well as future generations of Vitesse switch fabrics and other packet switching products. Some of the other leading suppliers providing the remaining components include SaRonix, Kulicke & Soffa and Gryphics.

"The immediate availability of the TeraStream chipset and reference platform allows Vitesse customers to expedite their design and implementation efforts by taking the guesswork out of high speed backplane designs," said Anita Weemaes, product marketing manager for Vitesse's TeraStream product family. "Vitesse has chosen to work with vendors such as Teradyne and NESA to deliver a complete, best-in-class bill of materials for a proven, high-performance systems solution."

"Vitesse's next generation chip technology, combined with Teradyne's expertise in multi-gigabit interconnect design, are melded together in this reference platform," said Robert Cutler, high-speed signal integrity expert for RDC Consulting. "The CAD layout and mechanical design were entirely focused on optimizing serial link signal integrity in a robust, reliable real-world system. Customers can leverage these system design features to minimize risk in their next project."

The TeraStream chipset, currently sampling, provides all fabric functionality including queuing, scheduling, SerDes, backplane communication, full redundancy, and optimized switching in only two ICs: one on the line card and one on the switch card.

About Vitesse

Vitesse Semiconductor Corporation is a leading designer and supplier of innovative, high-performance integrated circuits (ICs) and optical modules used in next generation networking and optical communications equipment. The Company's products address the needs of Enterprise, Access, Metro, Core, and Optical Transport network equipment manufacturers who demand a robust combination of high-speed, high-service delivery and low-power dissipation in their products. In concert with its broad communications product portfolio, Vitesse also develops ICs for storage area networking and enclosure management. Vitesse is headquartered in Camarillo, California, and operates two fabrication facilities: one in Camarillo and one in Colorado Springs, Colorado. Company and product information is available by calling 800/VITESSE or at www.vitesse.com.

About Teradyne Connection Systems

Teradyne Connection Systems (TCS), a division of Boston-based Teradyne, Inc., provides high performance system solutions to industry leading OEMs, with printed circuit boards, high-speed, high-density connectors, multi-gigabit backplane assemblies and complete systems integration and test. Teradyne's high-technology components and electronic manufacturing services are used by manufacturers of communications and computing systems central to building networking infrastructure. For more information visit www.teradyne.com/tcs.

About North East System Associates

NESA has been in the engineering design and service business since 1973. NESA's exposure and depth of involvement in state-of-the-art technology analysis and design provide clients with a breadth of experience to which they may not ordinarily have access. NESA is a full service engineering design firm, offering solutions in the areas of semiconductor reference designs, high speed buss and backplane design, component characterization, EMI and EMC engineering and electro-mechanical power and packaging, including thermal analysis and mechanical 3-D design. In addition, NESA provides professional seminars on an array of related technical topics. Clients include Fortune 500 companies, emerging technology start-ups, education and research institutions worldwide.