Press Release

International Engineering Consortium: Teradyne Takes Leadership Role at DesignCon East in Boston in June

CHICAGO--(BUSINESS WIRE)--March 18, 2003--Teradyne, Inc.'s (NYSE:TER) Connection Systems Division announced today that it will sponsor the IEC's DesignCon East 2003, June 23-25 in Marlborough, Massachusetts. DesignCon East brings practicing electronic-design engineers together in a practical educational program to share real-world design experiences. Keynote speakers at DesignCon East will be the following:

Bernard Gordon
Executive Chairman and Chairman of the Board
Analogic Corporation

Cherry Murray
Senior Vice President
Physical Sciences Research Lab, Lucent Technologies Bell Labs

GianGuido Rizzotto
Director, Corporate Technology Research and Development
ST Microelectronics

"We are pleased to see the support of key industry players such as Teradyne in the DesignCon East program," says Dr. Edward Sayre, President and Chief Executive Officer of North East Systems Associates, who will chair the first DesignCon East. "We are very excited about the program and feel that this is a major new event for the electronic-design community on the East Coast."

"DesignCon works well for Teradyne because it gives our engineers the opportunity to share field experiences and technology developments that help drive advances in the industry," says Rick Schneider, President of Teradyne's Connection Systems Division. "We are excited to see DesignCon come to Boston because the event addresses industry issues and will also emphasize the high-performance systems design challenges important to many of our partners and customers in the area."

A long-term success in the Bay Area, the DesignCon format has successfully demonstrated the value of a focused, practical educational conference for electronic-design engineers, presenting solutions to their most pressing design problems and held at a location where they work and live. This first DesignCon East meeting will continue that tradition, delivering highly applicable presentations and to-the-point demonstrations from leading engineers in the semiconductor and electronic-design industries. Technical sessions at DesignCon East include the following:

High-Performance Systems Design
Multi-Gigabit System
Design Challenges
New Limits for High Data-Throughput on Copper
Interconnect Design and Validation
High-Speed Validation, Board Level
High-Speed Timing
Chip-to-Chip Interconnect

Design System-on-Chip and ASIC Design
Functional Verification
Multi-Gigabit System Design
Configurable and Reconfigurable Designs

DesignCon East 2003 will take place Monday, June 23, through Wednesday, June 25, at the Royal Plaza Hotel and Trade Center in Marlborough, Massachusetts.

To register:
visit http://www.iec.org/events/2003/designcon_east/registration or contact conference relations at +1-312-559-4600 or events@iec.org.

About the International Engineering Consortium
The International Engineering Consortium is a nonprofit organization that seeks to catalyze advances and education in the communications industry. The Consortium develops conferences, research publications, and Web-based educational programs designed to meet the needs of professionals in industry and academia for continuing education and strategic market information. www.iec.org