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Press Release
Teradyne Connection Systems to be Official
Sponsor of the International Engineering Consortium’s
DesignCon East 2004
Educational Conference and Technical Exposition to take place
April 5-7 in Boxborough, Massachusetts
Nashua, New Hampshire, February 24,
2004 -- Teradyne, Inc. (NYSE:TER) Connection Systems Division
(TCS), the industry leader in high-performance connection
systems, today announced it will sponsor the IEC's DesignCon
East 2004, April 5-7 in Boxborough, Massachusetts. DesignCon
East brings practicing electronic-design engineers together
in a practical educational program to share real-world design
experiences.
George Chamillard, Chairman and Chief Executive
Officer of Teradyne, Inc. will provide a keynote address on
Tuesday, April 6th. On Wednesday, April 7th, the keynote will
be delivered by Ted Vucurevich, Senior Vice President, Office
of the Chief Technology Officer, Cadence Design Systems. In
addition the conference will feature more than 50 technical
sessions in the following tracks: IC Design, FPGA and Structured
ASIC Design, Functional Verification, Power and Packaging,
and High-Speed Interconnect, as well as live product demonstrations,
TecForums, and industry-focused panel discussions.
“We are pleased to see the
support of key industry players such as Teradyne,” says
Dr. Barry Sullivan, Director of the International Engineering
Consortium. “Last year DesignCon premiered on the East
Coast to hundreds of attendees and received very positive
feedback, particularly on the quality and practicality of
the engineering work presented.”
“DesignCon is the perfect venue for
us to speak to design engineers and system architects about
what their requirements are today and in the future. Our applications
and signal integrity engineers are at the show to demonstrate
Teradyne’s products and to learn how we can continue
to provide the best solutions for our customers’ needs,”
stated Rick Schneider, President, Teradyne Connection Systems.
A long-term success in the Silicon Valley
area, the DesignCon format has successfully demonstrated the
value of a focused, practical educational conference for electronic-design
engineers, presenting solutions to their most pressing design
problems and held at a location where they work and live.
This second DesignCon East meeting continues that tradition,
delivering highly applicable presentations and to-the-point
demonstrations from leading engineers in the semiconductor
and electronic-design industries.
DesignCon East 2004 will take place Monday,
April 5, through Wednesday, April 7, at Holiday Inn Boxborough
Woods, Boxborough, Massachusetts. To register: visit http://www.iec.org/events/2003/designcon_east/registration
or contact conference relations at +1-312-559-4600 or events@iec.org.
About Teradyne Connection Systems
Teradyne Connection Systems (TCS), a division of Teradyne,
Inc. (NYSE: TER), is the leader in high-performance connection
systems, designing and manufacturing backplane systems, printed
circuit boards and the industry's leading high-speed, high-density
connectors. TCS helps OEMs solve system design challenges
with integrated interconnect solutions for application in
the networking, communications, storage, computer server,
and medical equipment markets. For more information visit
www.teradyne.com/tcs.
About the International Engineering
Consortium
The International Engineering Consortium is a nonprofit organization
that seeks to catalyze advances and education in the communications
industry. The Consortium develops conferences, research publications,
and Web-based educational programs designed to meet the needs
of professionals in industry and academia for continuing education
and strategic market information. www.iec.org
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