Press Release

Inventors at Teradyne Connection Systems
Receive 19 Patents

Thirteen Teradyne Engineers Recognized for Technology Innovations

Nashua, NH, August 3, 2004 – Teradyne announced today that thirteen engineers employed at Teradyne Connection Systems (TCS) were awarded with nineteen patents for innovations related to the Division’s high-performance connection technologies. The patents were handed out at ceremonies held Friday, July 30th at the company’s Nashua, New Hampshire headquarters.

TCS’s engineering manager, Tom Pitten, presented plaques representing the individual inventions and patent numbers from the United States Patent Office to the thirteen inventors. The patents were issued during the last year and represent innovations associated with Teradyne’s optical and electrical connectors (such as GbX®, HD-Optyx™, NeXLev® and VHDM®), printed circuit boards, system architecture and several enabling technologies.

New Hampshire Governor, Craig Benson, attended the ceremony and congratulated the inventors on their achievements, noting the importance of technology innovation to the New Hampshire economy. George Chamillard, Chairman of Teradyne, Inc. and Rick Schneider, Teradyne Connection Systems President helped to present the awards.

About Teradyne Inc.
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2003, Teradyne had sales of $ 1.4 billion, and currently employs about 6100 people worldwide. For more information, visit www.teradyne.com. Teradyne is a trademark of Teradyne, Inc. in the US and other countries.

About Teradyne Connection Systems
Teradyne Connection Systems (TCS), a division of Teradyne, Inc., is the leader in high-performance connection systems, designing and manufacturing backplane systems, printed circuit boards and the industry's leading high-speed, high-density connectors. TCS helps OEMs solve system design challenges with integrated interconnect solutions for application in the networking, communications, storage, computer server, and medical equipment markets. For more information visit www.teradyne.com/tcs.