Press Release

Teradyne Connection Systems Introduces the
Aptera™ Low-Profile Connector

New Platform Optimized for Tight Packaging Challenges

Nashua, N.H. – Jan. 24, 2005 - Teradyne, Inc. (NYSE: TER) Connection Systems Division (TCS), the industry leader in high-performance connection systems, today announced the launch of its Aptera™ connector platform offering a low-profile solution for server, storage, and networking applications.

The Aptera connector’s low-profile design addresses difficult packaging challenges by balancing high-speed interconnect with the need to conserve board space and maximize airflow. The connector’s 10mm (.39") slot pitch offers flexibility for applications that need high-performance connectors in tight spaces. Electrical test results demonstrate excellent transmission characteristics and cross talk under 2 percent at a 50 pico second rise time (20-80%). Combined with a matched impedance interface and zero skew, the Aptera connector platform is scalable for future system design requirements.

“We worked very closely with our customers to develop this solution for tight slot pitch applications where thermal management was a significant challenge,” said Tom Pitten, Vice President Development Engineering at TCS. “Aptera’s low-profile design does not impede air flow and, at the same time, provides mechanical integrity that is far more robust than standard card edge connectors.

The Aptera connector’s modularity helps designers optimize the card edge by allowing them to choose appropriate connection types and the amount of signals. The connector features a straddle mount design with solder leads for the daughtercard and press fit for the backplane.

With dedicated power delivery and sequencing on the card edge, the Aptera connector provides the superior reliability and convenience of a backplane connector system.

Teradyne’s Aptera connector platform offers the following components: high-speed differential, single-ended, power, and an L-Series version for low speed data lines.

Pricing and Availability
Aptera is available in sample volumes beginning in April 2005. Volume pricing is anticipated to be $.08-$.12 per mated line.

Demonstrations:
Teradyne will exhibit at DesignCon 2005, February 1-2 in Santa Clara, California, Booth 211.

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 6,000 people worldwide. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks or registered trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.

About Teradyne Connection Systems
Teradyne Connection Systems (TCS), a division of Teradyne, Inc., is the leader in high-performance connection systems, designing and manufacturing backplane systems, printed circuit boards and the industry's leading high-speed, high-density connectors. TCS helps OEMs solve system design challenges with integrated interconnect solutions for application in the networking, communications, storage, computer server, and medical equipment markets. For more information visit www.teradyne.com/tcs.