Press Release

Teradyne’s High Performance Circuits Group Earns High Benchmark Scores in Printed Circuit Board Manufacturing

Nashua, NH – June 27 , 2005 – Teradyne, Inc. (NYSE: TER) Connection Systems Division, the industry leader in high-performance connection systems, today announced that Teradyne’s High Performance Circuits group (HPC) located in Nashua, NH has demonstrated competitive benchmark scores for printed circuit board manufacturing capability, quality and relative reliability.

Teradyne HPC recently submitted for test and analysis a total of 30 test panels of the standardized IPC PCQR2 12-layer, 0.093 inch thick, high technology design. These panels were fabricated in three different batches of 10 panels each with one week separating the start of each batch. Each 18" x 24" test panel was manufactured in an identical fashion using very complex criteria on 24" x 28" process panels.

“The IPC PCQR2 database evaluations are like the Consumer Reports of circuit board process capability,” said Dinis Anselmo, Front End Engineering Manager, Teradyne Connection Systems. “These tests and comparative analyses confirm that we make reliable technology with high levels of quality in printed circuit board manufacturing.”

“The IPC PCQR2 test and analysis data provides database subscribers with statistically based data to compare printed circuit board fabricator demonstrated capabilities and make informed supplier selection decisions,” said David Wolf, VP Technical Marketing, Conductor Analysis Technologies, Inc. (CAT, Inc.). Technology and program management for the IPC PCQR2 Database are provided by CAT, Inc.

Teradyne’s printed circuit boards can be used for manufacture of a variety of products in the telecommunications and military and defense industries which demand very high technology and highly reliable printed circuit boards.

For more information on the IPC PCQR2 Database, go to http://www.pcbquality.com.

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment, and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5,900 people worldwide. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.

About Teradyne Connection Systems
Teradyne Connection Systems (TCS), a division of Teradyne, Inc., is the leader in high-performance connection systems, designing and manufacturing backplane systems, printed circuit boards and the industry's leading high-speed, high-density connectors. TCS helps OEMs solve system design challenges with integrated interconnect solutions for application in the networking, communications, storage, computer server, and medical equipment markets. For more information, visit www.teradyne.com/tcs.

About Teradyne’s High Performance Circuits (HPC) Group
Teradyne Connection Systems’ New Hampshire-based printed circuit technology and fabrication capabilities include: a wide variety of materials to enable increasing signal speeds, deep microvias, buried, blind and backdrilled vias, sequential lamination, panel sizes from 16" x 18" up to 24" x 54", layer counts to 60+ and board thicknesses up to .500". Teradyne’s printed circuit fabrication facility is MIL-PRF-31032/1A, /2, MIL-P-55110 and ITAR certified.