|
Press Release
Teradyne Connection Systems Provides
Highest Density and Speed with Introduction of Ventura™
Connector;
Robust SMT Design Leads Industry in
Density and Speed
NASHUA, N.H.--(BUSINESS WIRE)--Sept. 20,
2005--Teradyne, Inc. (NYSE: TER) Connection Systems Division
(TCS), the industry leader in high-performance connection
systems, today announced the launch of its Ventura™
high-speed, high-density connector -- the fastest single-ended
interconnect with the most signal pins per inch of any connector
on the market.
Teradyne's Ventura connector features 178 real signals per
inch (single-ended) and 93 differential signals per inch in
its 14-row version. Using surface mount technology, the Ventura
design reduces via effects and enables higher performance
by replacing the standard compliant pin plated through hole
with a 10 or 12 mil via.
"Performance is important, but mechanical
connector robustness and ease of application are paramount,"
said Phil Stokoe, Teradyne Product Development Engineer. "By
applying advanced SMT technology to the Ventura connector,
we can successfully put down arrays with up to 5,000 contacts
with 100% success at the solder joints."
The Ventura connector's unique platform
allows it to be used in both 6.25 Gb/s single-ended, and 12
Gb/s differential applications. High-speed single-ended electrical
performance features cross talk of less than five percent
and insertion loss of less than 2 decibels (dB) at 6 GHz and
less than 3 dB at 8 GHz. Differential insertion loss is less
than 2 dB at 6 GHz and less than 3 dB at 10 GHz.
Other features include: connector backplane
pins with a new stub-proof design and more than 2.5mm of wipe;
a modular wafer design on both the backplane and daughtercard
for maximum configurability; and a unique rear organizing
stiffener for seamless integration of power and guidance modules.
Ventura's routing design permits very high-density signal
routing in both horizontal and vertical directions in the
backplane, allowing backplane designers to reduce costly printed
circuit board (PCB) layer counts while decreasing the time
required to route the backplane.
The Ventura platform currently includes
14-row, 8-row, and 8-row right angle male versions.
Pricing and Availability
Teradyne's Ventura connector is now available at approximately
$.18 - $.24 per mated signal line in full production volumes.
Demonstrations:
Teradyne will exhibit at DesignCon East, September 20-21 at
the DCU Center in Worcester, Massachusetts.
About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test
Equipment, and interconnection systems. The company's products
deliver competitive advantage to the world's leading semiconductor,
electronics, automotive and network systems companies. In
2004, Teradyne had sales of $1.8 billion, and currently employs
about 5,900 people worldwide. For more information, visit
www.teradyne.com. Teradyne(R) is a registered trademark of
Teradyne, Inc. in the US and other countries. All product
names are trademarks of Teradyne, Inc. (including its subsidiaries)
or their respective owners.
About Teradyne Connection Systems
Teradyne Connection Systems (TCS), a division of Teradyne,
Inc., is the leader in high-performance connection systems,
designing and manufacturing backplane
systems, printed
circuit boards and the industry's leading high-speed,
high-density connectors. TCS helps OEMs solve system design
challenges with integrated interconnect solutions for application
in the networking, communications, storage, computer server,
and medical equipment markets. For more information visit
www.teradyne.com/tcs.
Teradyne Media Contact:
Catherine Palmer
Teradyne Connection Systems
Tel: 603.879.3600
|
