Press Release

IEC Today Announces Winners of Highly-Coveted DesignVision Awards at DesignCon 2008

The International Engineering Consortium (IEC) today announced the best design tools of 2008 before hundreds of industry professionals live at DesignCon 2008, its annual semiconductor engineering event in Silicon Valley

SANTA CLARA, CALIFORNIA – Feb. 5, 2008 – The International Engineering Consortium (IEC) honored the DesignVision winners this afternoon before the Tuesday Keynote Address at DesignCon 2008; the conference and exhibition continues until Thursday this week at the Santa Clara Convention Center in Santa Clara, CA.

"This year's winners exemplify the highest level of innovation in today's industry," commented IEC Executive Vice President Roger Plummer. "We are pleased to congratulate all of the winners and recognize the products that received the 2008 DesignVision Award here at DesignCon!"

Winners were selected among 25 finalists who were chosen from among a record-breaking number of submissions and ranked by a panel of judges selected from the 2008 DesignCon Technical Program Committee. This year's Technical Program Committee consisted of 115 of the industry's top experts who served in the development of more than 120 sessions making up this year's educational program.

In each of the eight categories, the 2008 DesignVision winners include the following companies and products respectively:

ASIC and IC Design Tools
Cadence Design Systems, Inc. — Cadence Litho Electrical Analyzer

Design Verification Tools
Mentor Graphics and Cadence Design Systems, Inc. — Open Verification Methodology

Interconnect Technologies and Components
Amphenol TCS — XCede®

Semiconductors and ICs
Altera Corporation — Stratix III FPGA

Semiconductors and ICs (IP)
Rambus — The XDRTM Memory Architecture

Structured/Platform ASIC, FPGA, and PLD Design Tools
Lattice Semiconductor — LatticeXP2 FPGA Family

System-Level Design Tools
FuturePlus Systems, Corp. — FS5000 Jitterlyzer

Test and Measurement Equipment
Agilent Technologies — Agilent N6705A DC Power Analyzer

The award-winning products will be on display today and tomorrow on the DesignCon 2008 exhibition floor. The DesignCon 2008 exhibition will also feature EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies and more. It will bring box and board designers together with chip designers and others involved in system-level design.

Major sponsors of the event include Official Host Sponsor Agilent Technologies; Rambus; LeCroy; Tektronix; BERTScope; Amphenol; Cisco; Hewlett Packard; IBM; Intel; Redback Networks; Sun Microsystems; Xilinx; and Wipro. Visit www.designcon.com/2008/ for full information or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.

About DesignCon 2008
Now in its twelfth year, the International Engineering Consortium's DesignCon 2008 conference and exhibition will present more than 300 experts in its world-class educational program and 135 exhibitors on its cutting-edge exhibition floor this February 4-7, 2008 at the Santa Clara Convention Center in Santa Clara, CA. Agilent Technologies serves as the official sponsor and Mr. Terry Morris, a fellow of the high performance systems division at Hewlett-Packard, serves as the conference chair.

More than 120 premier educational sessions will complement five pavilions including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, the Verification Technology Pavilion and the University Pavilion. The DesignVision Awards and DesignCon Paper Awards also take place at the event giving tribute to outstanding contributions to the industry.

Co-located events include meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum will also feature panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference. For complete information, visit www.designcon.com/2008/

About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.