| 2010 | 2009 | 2008 | 2007 | 2006 | 2005 |
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February 1, 2010 |
Amphenol TCS expands the XCede Platform with XCede HD |
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February 2 |
Amphenol TCS expands the XCede Platform with 85 Ohm Connectors and High-Speed Cable Solutions |
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March 27 |
Amphenol TCS Launches Backplane Design Web Portal
DesignLink® Features Interactive Tools to Help OEMs Accelerate Backplane Designs |
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February 5 |
IEC Today Announces Winners of Highly-Coveted DesignVision Awards at DesignCon 2008
Amphenol's XCede connector among the winners |
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January 29 |
Stacking Version of Amphenol TCS XCede® Connector Platform Now Available
XCede Stacker Expands Successful 20+ Gbps Product System |
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January 22 |
Amphenol TCS Introduces the eHSD® Connector
Backwards Compatible to Scale Existing Systems to 10 Gbps+ |
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January 16 |
Amphenol TCS Extends AirMax VS® Platform as Identical Second Source for FCI
AirMax VS Vertical Header and Right Angle Receptacle Configurations Now Available |
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January 9 |
Electronic Products Magazine selects XCede for Product of the Year Award |
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October 31 |
Amphenol and FCI Sign Agreements for Next Generation High Speed Backplane Connectors XCede®, Crossbow™, ZipLine™ Connectors to Have Identical Second Sources |
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September 25 |
Amphenol TCS Second Sourcing of I-Trac Conditional on FCI-Molex Litigation and Market Demand |
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September 1 |
Electronic Design
Optimized Interconnect Eliminates Limits In Orthogonal Architectures
Contributed article by Robert Gustafson, Brian Kirk, Andreas Pfahnl |
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June 11 |
Amphenol TCS XCede® Backplane Link Evaluation Kit Now Available
Evaluates links supporting data rates up to 20 Gbps |
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January 29 |
XCede® Connector Platform from
Amphenol TCS -
Designed to Support 20+ Gbps Performance |
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February 17 |
Connector Specifier
Interconnects
overcome processing challenges
Contributed article by Phil Stokoe and Burke Hunsaker
of Amphenol TCS |
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February 7 |
Best
Innovators of Electronic Design Honored at DesignCon 2006 |
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February 1 |
Amphenol
TCS Launches Crossbow™ Connector Family |
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December 1 |
Acquisition
of Connection Systems Division of Teradyne, Inc. Reported
by Amphenol Corporation |
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October 10 |
Acquisition
of Connection Systems Division of Teradyne, Inc. Reported
by Amphenol Corporation |
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September 20 |
Teradyne
Connection Systems Provides Highest Density and Speed
with Introduction of Ventura™ Connector; Robust
SMT Design Leads Industry in Density and Speed |
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September 13 |
Teradyne
Connection Systems Introduces the GbX® E-Series Connector;
Extends Product Family with Enhanced Electrical Performance |
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July 1 |
Solving
the High-Speed Challenge for Space-Constrained Applications
By Chris Heard, Teradyne Hardware System Architect |
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June 27 |
Teradyne’s
High Performance Circuits Group Earns High Benchmark Scores
in Printed Circuit Board Manufacturing |
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May 10 |
Gore Signs
Teradyne Licensing Agreement
To Develop GbX® Cable Assemblies |
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May 1 |
Forms
of Shielding Take Sides - Air V. Plastic by Mark Gailus |
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April 12 |
Planet Analog
Storage
disk arrays pose challenges for chassis design
Contributed Article by Chris Heard, Hardware Architect,
Teradyne Inc. |
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March 4 |
Dewey
Defeats ...? Teradyne Quashes Forbes Report |
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February 1 |
The
Effects of LEAD-FREE on PCB Fabrication |
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January 31 |
Teradyne
Connection Systems Introduces
2-Pair Version of GbX Connector Platform |
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January 24 |
Teradyne
Connection Systems Introduces the Aptera™ Low-Profile
Connector |
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January 21 |
Teradyne
and Its Employees Contribute $140,000 to South Asia Relief
Efforts |
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January 17 |
Teradyne
Connection Systems Makes Technology Investments in Printed
Circuit Board Capabilities |
| 2006
| 2005 | 2004
| 2003 | 2002
| 2001 | 2000
| 1999 |
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December 16 |
Lucent
Technologies Honors Nine Top Suppliers with Third Annual
Golden Link Awards |
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October 4 |
Teradyne
Connection Systems Achieves ISO 14001 Certification at
Facilities in Shanghai, China and Penang, Malaysia |
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August 16 |
Teradyne’s
Connector Molding & Stamping Facility Achieves ISO
14001 Certifications |
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August 3 |
Inventors
at Teradyne Connection Systems Receive 19 Patents |
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July 15 |
Frost
& Sullivan Honors Teradyne for Customer Value Enhancement
in the Printed Circuit Boards Market |
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June 15 |
Teradyne
Introduces Design Guidelines For High-Performance Circuits
(HPC) |
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June 7 |
Molex
Signs Teradyne Licensing Agreement To Develop GbX Cable
Assemblies |
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April 6 |
Rambus
and Teradyne Raise the Bar on Performance of 10 Gbps Backplanes |
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April 5 |
Lattice
Semiconductor and Teradyne to Demonstrate Error-Free High-Speed
Data Transmission at DesignCon East 2004 |
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March 24 |
Connector Specifier
Profit by design: Aiming
for low-cost interconnect solutions
Contributed article by: Richard Humphrey or Teradyne Connection
Systems |
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March 22 |
Teradyne
Connection Systems Introduces the GbX® L-Series Connector |
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February 24 |
Teradyne
Connection Systems to be Official Sponsor of the International
Engineering Consortium’s DesignCon East 2004 |
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February 23 |
Teradyne
Connection Systems Joins UXPi - Unified 10 Gbps Physical-Layer
Initiative |
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January 26 |
Teradyne
Introduces HD-Optyx Connector - Industry’s First
Modular Optical Interconnect Architecture |
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January 12 |
Teradyne
Introduces VHDM H-Series Connector To Meet Demand for
OEM Platform Upgrade Solutions |
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January 6 |
Teradyne
High Performance Circuits Manufacturing Facility Achieves
ISO 14001 Certifications |
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January 1 |
Circuitree:
DFM:
A Process to Provide Best Solutions
Contributed Article by:
Chris Rolfe and Dinis Anselmo of Teradyne Connection Systems |
| 2006
| 2005 | 2004
| 2003 | 2002
| 2001 | 2000
| 1999 |
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December 11 |
Lucent
Technologies Honors Top Suppliers With Second Annual Golden
Link Awards |
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September 22 |
Accelerant
Transceiver Validates Teradyne Backplane in Less than
Two Days Using Lab In A Chip |
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June 24 |
Teradyne, Molex
Introduce VHDM 8-Row Right-Angle Male Connector |
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June 23 |
Rambus and
Teradyne To Demonstrate 10 Gbps Backplane Solution at
DesignCon East 2003 |
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May 20 |
Vativ and Teradyne
Demonstrate 6.25 Gb/s Performance Across 60 Inches on
FR-4 Backplane |
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May 5 |
NMS Communications
Selects Teradyne Connection Systems As Wired Equipment
Partner |
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April 14 |
Inventors at
Teradyne Connection Systems Receive 19 Patents |
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April 9 |
Design Solutions,
Inc. Opens Design Center at Teradyne Connection Systems;
Provides High Performance Circuit Design Services |
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April 4 |
Teradyne Awarded
Two Service Excellence Awards at APEX; Customers Commend
Teradyne's Assembly Test and Connection Systems Divisions |
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March 18 |
International
Engineering Consortium: Teradyne Takes Leadership Role
at DesignCon East in Boston in June |
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March 11 |
Teradyne Expands
Presence in China and Opens Shanghai Facility |
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February 24 |
Teradyne
Connection Systems Offers Deep Micro-Via Solutions
Connector Specifier |
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February 24 |
Teradyne Connection
Systems to Offer Deep Micro-Via Solutions; Extends Technology
Lead with Large Format High Performance Circuits |
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January 27 |
Teradyne Connection
Systems Introduces the VHDM L-Series Connector; Provides
Cost-Performance Optimized Solution |
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January 20 |
Teradyne Signs
Molex Incorporated as Second-Source Producer of GbXT High-Speed,
High-Density Connector |
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January 16 |
Teradyne to
Provide High Performance Circuits to Kaparel Corporation
for High-Speed Backplane Applications |
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| 2006
| 2005 | 2004
| 2003 | 2002
| 2001 | 2000
| 1999 |
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November 1 |
Avoiding
the Pressure:
Bypass the soldering problems; compliant pin connectors
are an effective alternative to surface mounting
Printed Circuit Design |
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November 1 |
Managing
the EMS Value Chain (pdf -292KB)
Circuits Assembly
Contributed article by Mike Fargo of Teradyne |
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October 22 |
Teradyne
Connection Systems Joins HSBI to Develop Specifications
for Interoperability at 5 Gb/s and Higher Speeds |
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October 7 |
Building
a 6.25-Gbit/s backplane
EE Times
Article By Gautam Patel of Teradyne and Bill Beale of
Accelerant Networks |
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September 12 |
Connector
Designers Strive for 10 Gb/s Speeds
EE Times |
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August 15 |
Teradyne,
Accelerant team on a 6.25-Gbit/s backplane
EE Times |
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August 8 |
Teradyne
Connection Systems to Close San Diego Printed Circuit
Board Facility |
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July 31 |
Teradyne
and Accelerant Networks Deliver the Industry's First 6.25
Gb/s Backplane Reference Platform |
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July 23 |
Teradyne,
Molex Launch Joint Website for VHDM-HSD Connectors |
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June 26 |
Teradyne,
Cadence And Xilinx Announce Industry's First Multi-Gigabit
Backplane To FPGA Design Solution |
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June 4 |
Vitesse
Demonstrates Reference Platform for High-Capacity Metro
and Core Networking Applications; Teradyne and NESA Assist
in Delivery of Real World System |
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April 29 |
Teradyne
Delivers Proven Performance and Reliability with VHDM®
and VHDM-HSD Connector Design for Manufacturability (DFM)
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March 26 |
Teradyne
and Taconic Announce Joint Manufacturing Agreement; Alliance
positions Taconic on the technology roadmap for high-speed
digital applications |
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March 6 |
Teradyne
Connection Systems Achieves ISO 14001 Certifications;
International Environmental Management System Standard
Awarded to Nashua, New Hampshire and Cavan, Ireland Facilities |
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March 1 |
Making
all the right connections
Article published in Modern Materials Handling |
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January 29 |
Teradyne
Releases GbX Platform Connector with Highest Density Pin
Counts for 10Gb/s Ethernet Application and Enhanced Signal
Integrity for Next Generation Transmission Rates of 5Gb/s
and Beyond |
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January 25 |
Teradyne
Receives Service Excellence Awards at APEX; Customers
Give High Marks for Electronics Assembly Equipment and
Electronic Manufacturing Services |
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| 2004 | 2003
| 2002 | 2001
| 2000 | 1999 |
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November 16 |
Challenges
for achieving 10Gbps copper backplanes
Article by Robert Cutler published in Electronic Engineering |
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November 1 |
Current Events
Technology Forecasters |
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October 18 |
Teradyne
Connection Systems Receives "Transformation Supplier of
the Year" Award from Cisco Systems |
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October 3 |
Backplane
Technology for Multigigabit Transmissions
Cover article by Marc Cartier, Tom Cohen, and Gautam Patel,
published in Connector Specifier |
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October 2 |
Teradyne's
NexLevT High-Speed Parallel Board-to-Board Connector Achieves
Telcordia GR-1217-CORE Compliance |
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October 1 |
Vertical
Integration is Focus at Teradyne EMS
Article from U.S. Tech |
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September 17 |
Teradyne
EMS Speeds Products to Market with Total Design for Manufacturability(DFM)
Solutions |
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September 11 |
Photonex
Partners For Manufacturing |
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September 5 |
Teradyne
to present, "A Comprehensive Reliability Approach to Interconnect
Design," (Sept. 25-26 in Seattle, WA) at the 2001 Workshop
on Accelerated Stress Testing co-sponsored by IEEE. |
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August 28 |
Teradyne's
Connection Systems division sponsors quarterly forum for
Electronic Manufacturing Services |
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June 22 |
Bandwidth
Demand Keeps Interconnect System Design at Leading Edge
(pdf file -- 621KB)
Article published in ECN |
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June 6 |
Teradyne
Announces Sale of Military Interconnection Business to
Amphenol |
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May 21 |
Teradyne
Number 1 in Boston Globe 100... |
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April 25 |
Teradyne
Connection Systems Introduces VHDM 6-row Stacking Interconnect;
High-Speed, High-Density Parallel Board Connector Expands
VHDM Product Family |
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March 26 |
Teradyne
Promotes Two to Division President and Hires a New CFO |
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January 29 |
Teradyne
Connection Systems Introduces GbX Platform Connector;
Connector Offers Upgrade Path Beyond VHDM and VHDM-HSD |
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January 18 |
Teradyne
Connection Systems Introduces 6-Row Differential-Pair
Version of VHDM® Interconnect |
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January 12 |
Teradyne
diversifies revenue stream with telecom products
-- Courtesy of bizjournals.com/boston |
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| 2006 | 2005
| 2004 | 2003
| 2002 | 2001
| 2000 | 1999 |
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November 20 |
Teradyne
Connection Systems Expands Assembly Capacity in Plano,
Texas |
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August 22 |
Teradyne
Opens New Manufacturing Facilities |
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August 16 |
Teradyne
Acquires Two Companies to Expand Capacity in its Interconnection
Business |
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August 8 |
Teradyne
Signs Molex Incorporated as Second-Source Producer of
High-Speed Interconnect |
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July 3 |
Product
Derivatives Introduced for VHDM Interconnect Family |
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January 26 |
NeXLev
Parallel Board Interconnect Provides 2.5Gb/s Performance
& 145 Real Signals per Inch |
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January 26 |
Teradyne
Introduces 5-Row Differential-Pair Version of VHDM Interconnect |
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| 2006 | 2005
| 2004 | 2003
| 2002 | 2001
| 2000 | 1999 |
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June 8 |
Teradyne's
New VHDM-HSD Interconnect Optimized for Differential Applications |
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