Backplane Assembly Services

Amphenol's goal is to maximize manufacturing flexibility and minimize costs while speeding your products to market. We do this with:

• Global NPI Strategy

• Vertical and virtual supply chain

• Continuous flow manufacturing to reduce cycle time and material handling

• Large format backplane process expertise

• Complex press-fit and surface mount (SMT) capability - including lead-free

• Industry-leading test capabilities

• Global applications engineering, NPI & DFM support

All sites are full integrated to ensure consistency in every operation and real-time communication.

• Local engineering, program management, materials planning, and customer service

• Global account teams manage all local production & services for seamless communication and support

All sites are qualified to the same rigorous quality and industry standards.

• ISO 2000

• ISO 14001

• IPC

• UL - Underwriters Laboratories Inc.

New Product Introduction (NPI)

Amphenol TCS Focus	Customer Results
Focused prototype capability Real-time communication Engineered for flexibility	Reduced prototype cycles Rapid response Seamless transition to volume

Comprehensive Test Solutions

Multiple backplane test platforms and layered test approach
	Design for test
	Individualized test plans
	Diagnostic capabilities
Fixtureless testing Ideal for low volume production
	Speed product to market
	Rapid feedback
	Reduced test costs
	Working prototypes
	Ideal for complex assemblies at low volumes
Level II and III Isolation, continuity, and net resistance values
	Dual-side (top and bottom) testing
	Up to 88,000 points
	Dedicated fixture
	Oversized press capabilities
In-Circuit Test Basic functionality of active and/or passive devices
	5,000 test points
	Analog test, vectorless test, digital and mixed-signal vector test, and boundary-scan test capabilities
	In-line device programming of Flash, EEPROM, and FPGAs
	Extended VXI card cage for integration of 3rd party C-sized VXI instruments
Functional Test Performance verification and test of electronic assemblies
	ILDP (In-Line Device Programming) for Flash and in-system programming
	Memory programming
	Basic functional test using analog instruments
	Boundary-scan testing
	Static digital testing
	Flexibility to move test to the appropriate point in production
	Customized power-up capabilities
Other Test Capabilities
	E-Prom device programmers
	Optical test
	Hi-Pot test
	Dielectric withstanding
	X-Ray