Backplane Design to Optimize Your System Architecture

Amphenol's unique combination of in-depth printed circuit backplane design and fabrication expertise and industry leading backplane connector technology enables the best possible interconnect system designs.

Delivering data rates up to 20 Gbps and higher Field-proven mechanical reliability Lower system costs - optimize for performance and value Designed for manufacturability

An Extension of Your Design Team

Amphenol's design and applications engineering experts apply knowledge gained from thousands of successful backplane designs to your project and deliver an integrated backplane system with superior signal channel performance at an optimized cost.

Leading signal integrity capabilities Accurate system performance models PCB layout, routing, materials, microvia engineering Mechanical & industrial design Power & thermal analysis Regulatory & compliance testing

NPI Focus Speeds You to Market

Our global engineering resources and NPI manufacturing capabilities get you to market fast with the right product, right the first time.

Rapid design validation Fixtureless test Post-build review

Amphenol TCS's experienced team of engineers and on-line design tools enable key early backplane design and system design decisions, such as printed circuit board materials and connector choice and options for routing optimization that can significantly reduce layer count.

"By offering backplane design solutions and advice related to signal integrity between the chip… the design of the PCB and finally, the connector, Amphenol TCS has the total backplane channel covered.” Ken Fleck Fleck Research

Signal Integrity Capabilities
	Complete link simulation
	Connectors (CST)
	Footprints (CST, HFSS)
	Etch and PCB material (HFSS, Maxwell 2D)
	Link Models (Designer, HSpice, ADS)
	Distributed computing environment

Measurement
	Frequency and time domain
	De-embedding and calibration methodology
	Agilent 8364B VNA. 10MHz-50GHz

Total system cost is critical and requires a balance of many component and interconnect design strategies. A number of variables can affect bandwidth, such as channel loss, crosstalk, connector choice, via, trace geometry, PCB material thickness. Each of these interrelated factors will also affect system costs. Balancing those requirements is what we do best at Amphenol TCS.  For example:

	Higher density connectors and horizontal and vertical routing capability reduce PCB layer count – decreasing backplane cost
	Modular interconnect solutions with integrated power and guidance can replace separate more expensive and less robust connector choices.
	Mezzanine and coplanar connectors increase system yields and design re-use
	Backdrilling the PCB has demonstrated high reliability and may provide the best cost/performance balance.