Backplane Connectors

Amphenol's XCede® HD connector leverages the same core technologies as standard XCede, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede HD achieves the highest performance in an HM compatible form factor.

Amphenol's XCede connector platform is designed to enable future data rate requirements of datacom, telecom, storage and wireless equipment with scalable performance from 8 to 25 Gbps.

Amphenol's eHSD® connector is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures.

When high-performance and high-density are required, Amphenol's Ventura® connector meets the challenge. The Ventura platform can deliver data at 6.25 Gb/s per signal - the fastest single-ended connector available - and reach speeds of 12 Gb/s when driven differentially.

Difficult electronic packaging challenges require innovative solutions. Amphenol's Aptera connector meets these challenges with a high-speed interconnect designed specifically for space constrained areas without impeding airflow.

The GbX I-Trac Backplane Connector System uses a broadside-coupled, skew-equalized contact design scalable to data rates up to 6-8 Gbps. The open pin field design gives designers the ability to assign high-speed differential pairs, low-speed signals, power and ground contacts anywhere within the pin field. Orthogonal cards in a midplane design can share vias and allow layer count reduction by passing signals directly through the midplane. GbX I-Trac is available in 100 ohm and 85 ohm wafers.

Amphenol's GbX connector is a high-density optimized differential connector with a choice of density configurations. GbX provides increased density, exceptional impedance matching, and low crosstalk.

Upgrade to enhanced electrical performance without costly redesign. The GbX E-Series backplane module shares the same footprint as standard GbX and easily scales to data rates up to 6.25 Gb/s.

An open pin field, lower speed version of GbX with backwards compatibility for cost-performance optimized solutions.

Upgrade to enhanced electrical performance by changing the backplane half only. The GbX U-Series backplane module incorporates a new footprint and backplane housing designed for lower crosstalk and easily scales to data rates up to 10 Gb/s. All generations of GbX daughtercard connectors are compatible with GbX U-Series.

An open pin field, lower speed version of VHDM with backwards compatibility for cost-performance optimized solutions.

Improved signal integrity and backwards compatibility for fast, easy system upgrade solutions.

VHDM-HSD is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures.

Amphenol's VHDM® interconnect platform reliably provides the high-density and high-speed signal integrity that today's demanding platforms require in backplane and daughtercard connectors.

Amphenol's High Density Metric (HDM) and High Density Metric Plus (HDM PLUS) connector family is designed for applications that demand a combination of high signal pin density plus high-speed signal integrity.

High Density Plus® (HD Plus) is a complete family of board to backplane connectors that offers the benefits of high interconnect density, design flexibility, and signal integrity.