Mezzanine Connectors
Amphenol's InfinX high-density parallel board connector is the solution to meet increasing bandwidth demands in mezzanine applications.
The XCede® Stacker enables parallel board to board designs with the same high levels of performance and reliability as the XCede backplane system. Components are readily available in 85 and 100 ohm impedance.
Low profile stacker connector designed to address difficult packaging challenges by balancing high-speed interconnect, airflow, and space constraints. This cost effective solution offers superior electrical performance to 6 Gb/s and is very mechanically robust.
Amphenol's NeXLev high-density parallel board connector is the solution to meet increasing bandwidth demands in mezzanine applications.
Enables design of parallel board-to-board connections with the high-speed, high-density performance of VHDM. Stacking heights of 18mm and 28mm's. 76 real signal pins per inch Designed to mate with standard VHDM male headers.
The HDM Stacker connector can be used in parallel board packaging, mezzanine cards, parallel backplanes and bridgeboard applications. Stacking heights from 15 to 32 mm. Available in 72-pin and 144-pin signal modules in soldertail or press fit configurations.
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Aptera, Crossbow, eHSD, GbX, HD Plus, HDM Plus, HDM, HD-Optyx, InfinX, NeXLev, Ventura, VHDM, VHDM-HSD, XCede, Amphenol DesignLink, DesignLink and Amphenol are trademarks or registered trademarks of Amphenol Corporation. All other products names are the marks of the respective owners.