Optimized Backplane Design

Total system cost is critical and requires a balance of many component and interconnect design strategies. A number of variables can affect bandwidth, such as channel loss, crosstalk, connector choice, via, trace geometry, PCB material thickness. Each of these interrelated factors will also affect system costs. Balancing those requirements is what we do best at Amphenol TCS...for example:

	Higher density connectors and horizontal and vertical routing capability reduce PCB layer count – decreasing backplane cost
	Modular interconnect solutions with integrated power and guidance can replace separate more expensive and less robust connector choices.
	Mezzanine and coplanar connectors increase system yields and design re-use
	Backdrilling the PCB has demonstrated high reliability and may provide the best cost/performance balance.

Learn More Overview Backplane Design     Signal Integrity    Optimized Design Backplane Assembly Services    NPI    Test Solutions Most Popular Advanced Design Techniques to Support Next Generation Backplane Links Beyond 10 Gbps Practical Guides for the Implementation of Back Drilling Plated Through Hole Vias in Multi-gigabit Board Applications XCede Backplane Link Evaluation Kit Amphenol Printed Circuits