Signal Integrity

Amphenol TCS's experienced team of engineers and on-line design tools enable key early backplane design and system design decisions, such as printed circuit board materials and connector choice and options for routing optimization that can significantly reduce layer count.

"By offering backplane design solutions and advice related to signal integrity between the chip… the design of the PCB and finally, the connector, Amphenol TCS has the total backplane channel covered.” Ken Fleck Fleck Research

Signal Integrity Capabilities
	Complete link simulation
	Connectors (CST)
	Footprints (CST, HFSS)
	Etch and PCB material (HFSS, Maxwell 2D)
	Link Models (Hspice)
	Distributed computing environment

Measurement
	Frequency and time domain
	De-embedding and calibration methodology
	Agilent 8364B VNA. 10MHz-50GHz

Learn More Overview Backplane Design     Signal Integrity    Optimized Design Backplane Assembly Services    NPI    Test Solutions Most Popular Advanced Design Techniques to Support Next Generation Backplane Links Beyond 10 Gbps Practical Guides for the Implementation of Back Drilling Plated Through Hole Vias in Multi-gigabit Board Applications XCede Backplane Link Evaluation Kit Amphenol Printed Circuits