Comprehensive Test Solutions

Multiple backplane test platforms and layered test approach
	Design for test
	Individualized test plans
	Diagnostic capabilities
Fixtureless testing Ideal for low volume production
	Speed product to market
	Rapid feedback
	Reduced test costs
	Working prototypes
	Ideal for complex assemblies at low volumes
Level II and III Isolation, continuity, and net resistance values
	Dual-side (top and bottom) testing
	Up to 88,000 points
	Dedicated fixture
	Oversized press capabilities
In-Circuit Test Basic functionality of active and/or passive devices
	5,000 test points
	Analog test, vectorless test, digital and mixed-signal vector test, and boundary-scan test capabilities
	In-line device programming of Flash, EEPROM, and FPGAs
	Extended VXI card cage for integration of 3rd party C-sized VXI instruments
Functional Test Performance verification and test of electronic assemblies
	ILDP (In-Line Device Programming) for Flash and in-system programming
	Memory programming
	Basic functional test using analog instruments
	Boundary-scan testing
	Static digital testing
	Flexibility to move test to the appropriate point in production
	Customized power-up capabilities
Other Test Capabilities
	E-Prom device programmers
	Optical test
	Hi-Pot test
	Dielectric withstanding
	X-Ray

Learn More Overview Backplane Design     Signal Integrity    Optimized Design Backplane Assembly Services    NPI    Test Solutions Most Popular Advanced Design Techniques to Support Next Generation Backplane Links Beyond 10 Gbps Practical Guides for the Implementation of Back Drilling Plated Through Hole Vias in Multi-gigabit Board Applications XCede Backplane Link Evaluation Kit Amphenol Printed Circuits