Aptera™
High Performance - Low Profile Solutions

Difficult electronic packaging challenges require innovative solutions. Amphenol’s Aptera connector meets these challenges with a high-speed interconnect designed specifically for space constrained areas without impeding airflow.

	Ideal for the space constraints of high-speed memory and card edge applications
	Streamlined construction allows optimal airflow
	Less than 2% crosstalk at 50 picoseconds (20-80%)
	Impedance controlled
	Optimize your card edge with a mixture of high-speed signals, low-speed signals, and power
	Superior mechanical integrity

Flexibility for Optimized Solutions
Aptera’s design incorporates Amphenol’s modular connector architecture, providing designers with a high level of flexibility to meet performance requirements. Components are designed to work together, using similar footprints for a streamlined construction allowing for optimal airflow.

	Low profile construction reduces minimum slot pitch between daughtercards to 10mm (.39")
	SMT daughtercard termination to the card edge
	Supports various daughtercard thicknesses
	Backplane components and slot pitch remain consistent regardless of daughtercard thickness

Aptera's modular design allows for high-speed, low-speed, single-ended, differential and power modules on the same card edge for optimized performance

Version	Density	Contact Pitch*
Standard	46 signals per inch (18 signals per 10mm)	.043" (1,1mm)
Stacker	46 signals per inch (18 signals per 10mm)	.043" (1,1mm)
Power	15 contacts per inch (6 contacts per 10mm)	.138" (3,5mm)
*Does not include length of end guides.