| Magazine
Articles |
File
Type |
Size |
Speed
Demands Accurate Models
EE Times, January 2003
By Gautam Patel of Amphenol TCS and Ravi Kollipara
of Rambus, Inc. |
HTML |
-- |
Challenges
for achieving 10Gbps copper backplanes
Electronic Engineering, November 2001 |
PDF |
130KB |
Backplane
Technology for Multigigabit Transmissions
Connector Specifier, October 2001 |
HTML |
-- |
| White
Papers |
File
Type |
Size |
| Presented at DesignCon
2003
Connector and Chip Vendors Unite to Produce a
High-Performance 10 Gb/s NRZ-Capable Serial Backplane
view
abstract | request
a copy
Authors: Gautam Patel of Amphenol TCS, Matt Shafer
and Bodhi Das of Xilinx Inc. |
PDF |
2.1M |
| Presented
at DesignCon 2003
Signal-Integrity Measurements Support the Candidacy
of PTFE at High Data Rates
view
abstract | request
a copy
Authors: Meagan Morrell of Amphenol TCS and
Thomas McCarthy of Taconic |
PDF |
1.6M |
| Presented at Electronica
2000
Designing 3.125 Gbps Backplane Systems
view
& download paper
Authors: Gautam Patel and Kevin Ryan of Amphenol
TCS |
PDF |
7.6M |
Web Proforum - IEC On-Line
Tutorial - 2002
Signal Integrity-Multi-Gigabit
Transmission over Backplane Systems
view
& download paper
|
HTML |
-- |
| Presented at DesignCon
2001
Signal Integrity Considerations for 10 Gb/s
Transmission Over Backplane Systems
view
& download paper
Authors: Marc Cartier, Tom Cohen, and Gautam
Patel of Amphenol TCS and Jeff Smith of AMCC |
PDF |
1.5M |
| Backplane
Reference Designs |
|
|
Xilinx
RocketIO - Amphenol GbX
Amphenol TCS and Xilinx, Inc. demonstrate a fully
programmable, 2.5 to 10 Gb/s solution for system
designers seeking to operate at advanced speeds
over backplanes. (FPGA) |
HTML |
-- |
Lattice
ORT82G5 and GbX Error-free Operation at 3.7 Gb/s
Amphenol TCS and Lattice Semiconductor demonstrate
real-world solutions for designers of high-performance
backplanes seeking high-speed error free data transmission.
(SerDes) |
HTML |
-- |
Maxim
MAX3804 Equalizer - Amphenol's GbX Connector
Maxim and Amphenol TCS demonstrate 6.25 Gb/s and
10 Gb/s data rates over conventional backplane technology.
The reference platform utilizes Teradyne's GbX high-speed,
high-density connectors, along with Maxim’s
MAX3804 equalizer. (Equalization) |
HTML |
-- |
| Press
Releases |
File
Type |
Size |
Gore
Signs Teradyne Licensing Agreement
To Develop GbX® Cable Assemblies
May 2005 |
HTML |
-- |
Teradyne
Connection Systems Introduces the
GbX® L-Series Connector
March 2004 |
HTML |
-- |
Rambus
and Teradyne To Demonstrate 10 Gbps Backplane Solution
at DesignCon East 2003
June 2003 |
HTML |
-- |
Vativ
and Teradyne Demonstrate 6.25 Gb/s Performance Across
60 Inches on FR-4 Backplane
May 2003 |
HTML |
-- |
Inventors
at Teradyne Connection Systems Receive 19 Patents
April 2003 |
HTML |
-- |
Teradyne
Signs Molex Incorporated as Second-Source Producer
of GbXT High-Speed, High-Density Connector
January 2003 |
HTML |
-- |
Teradyne
Connection Systems Joins HSBI to Develop Specifications
for Interoperability at 5 Gb/s and Higher Speeds
October 2002 |
HTML |
-- |
Vitesse
Demonstrates Reference Platform for High-Capacity
Metro and Core Networking Applications; Teradyne
and NESA Assist in Delivery of Real World System
June 2002 |
HTML |
-- |
Teradyne
Releases GbX Platform Connector with Highest Density
Pin Counts for 10Gb/s Ethernet Application and Enhanced
Signal Integrity for Next Generation Transmission
Rates of 5Gb/s and Beyond
January 2002 |
HTML |
-- |
Teradyne
Connection Systems Introduces GbX Platform Connector;
Connector Offers Upgrade Path Beyond VHDM and VHDM-HSD
January 2001 |
HTML |
-- |
| Drawings |
File
Type |
Size |
| GbX
product drawings |
HTML |
-- |
| Technical
Bulletins |
File
Type |
Size |
| GbX
technical bulletins |
HTML |
-- |
| Tooling
& Repairs Information |
File
Type |
Size |
| GbX
tooling & repair information |
HTML |
-- |
| ROHS
Compliance |
File
Type |
Size |
| GbX
ROHS Certificates of Compliance |
HTML |
-- |
