High Density Plus® Configuration

HD Plus

Open 80 position pressfit module with wire wrap tails.

HD Plus I

Backplane module with shield mating contacts, Plus I

HD Plus II

Backplane module with shield mating contacts,
Plus II

HD Plus with Endwall

Backplane connector modules can be specified with or without end guide wall. For sufficient guidance, it is recommended that the end-wall configuration be used on the two outer modules on each connector pattern. End-wall modules are not necessary when either a guide pin or power module are specified.

HD Plus with Polarizing

Backplane connector modules can be specified with or without D-shaped polarizing keys. Note: polarizing option requires corresponding polarizing module on daughtercard connector assembly. Customer drawings must indicate orientation of keys in all instances. Applications that specify polarizing also require a guide pin.

Power Modules

Backplane power modules are available in standard and protected versions. Both interface with either printed circuit inner layers or with external bus bars.

Protected Power Module

A unique plastic cover reduces the chance of accidentally shorting power contacts.

Contact Density

Illustration depicts 540 total contacts in 9.2 inch connector length. Maximum contact density: 120 total contacts per module.

Low inductance Plus I and Plus II contacts reduce crosstalk and ground bounce

Design Flexibility

Omit modules for cost saving and to clear mechanical supports.

Use polarizing/guidance only when required.

Power Distribution

Low IR losses with external bus bars.

Refer to the High Density Plus Power Distribution Data Sheet for components used with external bus bar assemblies.

HD Plus Daughtercard

The Right Angle Daughtercard module available in 60 and 80 position.

HD Plus I Daughtercard

The Plus I Module uses the shield on the shortest leads.

HD Plus II Daughtercard

Plus II uses external sheilds on both sides of the module.

HD Plus Daughtercard Polarizing Module

Individual polarizing modules are available. D-shaped pins are indexed in any of eight positions according to customer requirements. Note: polarizing option requires corresponding polarizing connector on backplane assembly. This example shows pin in position 'G.'

HD Plus Daughtercard Power Modules

Daughtercard power modules are rated at 20 amps per contact

Guide Pin Receptacle Module

Individual guide-pin receptacle module. Note: guide pin receptacle modules require corresponding guide pin mounted on the backplane assembly.

Daughtercard Stiffener

High Density Plus-series daughtercard connector assemblies are supplied with an extruded aluminum stiffener that accurately aligns the individual connector modules while eliminating warp and bow on large daughtercards. Contact tail alignment guides are provided on all connector assemblies.

Three different extrusion profiles are shown below:

Contact Density

60 contacts per linear inch of connector length

Plus One and Plus Two contact rows provide electromagnetic shielding of signal contacts.

Design Flexibility

Omit modules for cost savings

Locate modules at random spacings

Power Distribution

437-series dual power modules rated at 40A each

Plus One contacts used for voltage returns (GND)