Amphenol's backplane connectors offer a
wide range options to meet your system requirements providing
such features as shield signals, sequence power, and keying.
XCede™
20 Gbps |
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The industry’s highest performing backplane interconnect system |
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Up to 82 differential pairs per inch (32 differential pairs per centimeter) |
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Innovative 3D resonance damping shield technology |
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De-skewed differential pairs |
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Secondary routing channels significantly lower backplane costs |
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eHSD™
Up to 10 Gbps |
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Fully backwards compatible with VHDM-HSD, delivering up to 10 dB lower crosstalk |
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Scale existing systems to next generation speeds |
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3-5X reduction in wafer-to-wafer crosstalk |
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Ventura®
Up to 10 Gbps |
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High-density, high-performance single-ended connector |
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10+ Gbps differential, 6.25 Gbps single-ended |
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102 - 178 real signals per inch (40 - 70 signals per centimeter) |
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Surface mount attach |
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GbX®
2.5 - 5.0+ Gbps |
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27.5 - 69 differential pairs per inch (11 - 27 differential pairs per centimeter) |
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Ideal for 4 x 3.125 XAUI links |
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Full range of proven components (e.g. power, guidance, polarizing) |
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Robust mechanical design |
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GbX®
E-Series
5.0+ Gbps |
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Enhanced electrical performance |
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Crosstalk as low as 2% |
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Backplane module shares the same footprint as standard GbX |
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GbX®
L-Series
< 1 Gbps |
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1.85mm x 1.85mm open pin field version of GbX |
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Customize signal integrity performance by varying ground-to-signal ratio |
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Ideal for TTL sense and control and other low-speed data lines |
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AirMax®
2.5 - 6.25+ Gbps
AirMax is a registered trademark of FCI |
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Shieldless connector system |
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Cost-effective interconnect for multi-gigabit applications |
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Up to 63 differential pairs/inch |
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Aptera™
Up to 6 Gbps |
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Low-profile, high-reliability
2-piece edge-card connector |
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6 Gbps performance differential; 3 Gbps
single-ended |
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Low-profile construction reduces minimum slot pitch between daughtercards to 10mm (.39”) |
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Right angle and stacker versions and power module available |
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VHDM-HSD™
Up to 5 Gbps |
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Optimized for high-speed differential backplane applications |
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25 - 38 differential pairs per inch (10 - 15 differential pairs per centimeter) |
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Modular design enables mix of single-ended and differential signals within the same connector |
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VHDM®
3.125+ Gbps |
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Optimized for single-ended, high-density applications |
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76 - 101 real signals per inch (30 - 40 real signals per centimeter) |
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Less than 5% crosstalk |
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Stripline shielding allows 100% of the pins to be used for signals |
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VHDM®
H-Series
6.25+ Gbps |
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Superior signal integrity |
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Backwards compatible with the full VHDM product family - design into same slot for fast, easy system upgrades |
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0.018” (0,045mm) PCB hole for improved performance |
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VHDM®
L-Series
< 1 Gbps |
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Open pin-field version of VHDM |
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Fully compatible with the full VHDM product family to optimize cost and performance by mixing high- and low-speed signals on the same connector |
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Ideal for TTL sense and control and other low-speed data lines |
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HDM®
HDM® Plus
< 1 Gbps |
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Economical 2mm modular design |
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75 real signals per inch (30 contacts per centimeter) |
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Can operate in applications with rise times as low as 500 pico seconds |
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