VHDM® Configuration

The VHDM backplane module comes in two lengths, 10 position or column and 25 position. The matching daughtercard configuration is in multiples of 10 or 25 signal "wafers" (2 mm each). These modules can be combined with power modules and modules containing polarizing and guidance to achieve the desired pin count and mix of features. The Illustrations below show the basic dimensional footprints for these respective modules.

VHDM Daughtercard 6-Row

Module Description	Dim A	Dim B	Dim C	Signal Pins
Daughtercard Signal Module, 6 row, 10 position	10 x 2 = 20	15,9	n/a	60
Daughtercard Signal Module, 6 row, 25 position	25 x 2 = 50	15,9	n/a	150
Daughtercard Polarizing/Guidance Module, 6 row	8	15,0	n/a	n/a
Daughtercard Power Module, 6 row	6	14,8	n/a	2 contacts
End Cap, 6 row (not shown)	2	n/a	n/a	n/a

VHDM Backplane 6-Row

Module Description	Dim A	Dim B	Dim C	Signal Pins
Backplane Signal Module, 6 row, 10 position	20	17,1	n/a	60
Backplane Signal Module, 6 row, 25 position	50	17,1	n/a	150
Backplane Polarizing/Guidance Module, 6 row, 10 position	27	17,1	7	60
Backplane Polarizing/Guidance Module, 6 row, 25 position	57	17,1	7	150
Backplane Power Module, 6 row	n/a	n/a	n/a	2 blades

VHDM Daughtercard 8-Row

Module Description	Dim A	Dim B	Dim C	Signal Pins
Daughtercard Signal Module, 8 row, 10 position	10 x 2 = 20	20,3	n/a	80
Daughtercard Signal Module, 8 row, 25 position	25 x 2 = 50	20,3	n/a	200
Daughtercard Polarizing/Guidance Module, 8 row	8	19,6	n/a	n/a
Daughtercard Power Module, 8 row	6	18,3	n/a	3 contacts
End Cap, 8 row (not shown)	2	n/a	n/a	n/a

VHDM Backplane 8-Row

Module Description	Dim A	Dim B	Dim C	Signal Pins
Backplane Signal Module, 8 row, 10 position	20	21,6	n/a	80
Backplane Signal Module 8 row, 25 position	50	21,6	n/a	200
Backplane Polarizing/Guidance Module, 8 row, 10 position	27	21,6	7	80
Backplane Polarizing/Guidance Module, 8 row, 25 position	57	21,6	7	200
Backplane Power Module, 8 row	n/a	n/a	n/a	3 blades

Note: Dimensions are in millimeters, Dimension C refers to the additional space, included in dimension A, occupied by the polarizing/guidance feature.
Note: All dimensions are for reference only. Consult latest customer print for value.

	Daughtercard Signal Modules The VHDM daughtercard connector is comprised of press-fit signal wafers mounted on a stainless steel rear organizer also called a stiffener. Wafers are assembled in multiples of 10 or 25 to align with the sizes of the mating backplane connectors.
	Backplane Signal Module Available in press-fit 10 and 25 column configurations with open ends for end to end stacking. End stacking of the modules enables connector configurations of up to 24 inches or longer.
	Power Module Press-fit power modules are UL rated for 10 Amps/ 250 Volts per power blade. The VHDM-HSD 8-Row power module contains 3 blades. Current interruption applications are rated at 4 Amps / 80 Volts per power blade. The VHDM-HSD 6-Row power module contains 2 blades. Current interruption applications are rated at 4 Amps / 80 Volts per power blade. The VHDM-HSD 5-Row power module contains 2 blades. Current interruption applications are rated at 4 Amps/80 Volts.
	Guidance & Keying Press-fit backplane modules are available in 10 and 25 column configurations with integrated guidance and keying posts. (See photo) Other guidance and keying options include stand-alone guide modules (pictured), ESD guide modules, board mounted guide pins and anti-rotation guide modules.
	Advanced Mate Shielding The Advanced Mated Backplane connector shields advance the mating of the ground shields by 1mm over the standard height shield. This advance mating assures that the shields mate ahead of the 4.75mm signal pins for hot plugging applications.
	Sequencing - 4 levels (signals) and 3 levels (power) VHDM provides 4 signal pin mating heights and 4 power blade mating heights to enable mating sequencing for hot plugging applications.
	Joiners VHDM daughtercard connectors can be extended to lengths exceeding the single stiffener limitation of 12 inches with the use of the joiner module. The joiner module positions and stabilizes the individual connector assemblies for consistent registration and alignment.
	End Caps End caps are available to provide additional protection to the end wafers on the assembled daughtercard connectors.
	Plating Options 30µ" and 50µ" gold plating options available for mating contacts.