| Magazine
Articles |
File
Type
|
Size
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Speed
Demands Accurate Models
EE Times, January 2003
By Gautam Patel of Teradyne and Ravi Kollipara of
Rambus, Inc. |
HTML
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|
Building
a 6.25-Gbit/s backplane
EE Times, October 2002
Article By Gautam Patel of Teradyne and Bill Beale
of Accelerant Networks |
HTML
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Connector
Designers Strive for 10 Gb/s Speeds
EE Times, September 2002 |
HTML
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Teradyne,
Accelerant team on a 6.25-Gbit/s backplane
EE Times, August 2002 |
HTML
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Bandwidth
Demand Keeps Interconnect System Design at Leading
Edge
ECN, June 2001 |
PDF
|
621KB
|
| White
Papers |
File
Type
|
Size
|
Presented at DesignCon 2003
Connector and Chip Vendors Unite to Produce
a High-Performance 10 Gb/s NRZ-Capable Serial
Backplane
view
abstract | request
a copy
Authors: Gautam Patel of Teradyne, Matt Shafer
and Bodhi Das of Xilinx Inc.
|
PDF
|
2.1M
|
Web Proforum
- IEC On-Line Tutorial - 2002
Signal Integrity-Multi-Gigabit Transmission over
Backplane Systems
view
& download paper |
HTML
|
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|
|
Presented at DesignCon 2001
Using Creative Silicon Technology to Extend
the Useful Life of Backplane and Card Substrates
at 3.125 Gbps and Beyond
view
& download paper
Authors: Robert Cutler of Teradyne and Paul Galloway
and Kevin Roselle of Velio
|
PDF
|
1.2M
|
|
Presented at DesignCon 2001
2.5 Gbps Backplane Design, Simulation, and
Measurement
view
& download paper
Author: Gautam Patel of Teradyne and John Goldie
of National Semiconductor
|
PDF
|
7.7M
|
|
Presented at DesignCon 2001
Signal Integrity Considerations for 10 Gb/s
Transmission Over Backplane Systems
view
& download paper
Authors: Marc Cartier, Tom Cohen, and Gautam
Patel of Teradyne and Jeff Smith of AMCC
|
PDF
|
1.5M
|
|
Presented at DesignCon 2002
Overcoming Design Challenges to Reach 1 Tbps
Bandwidth for a Star Configuration Backplane Using
FR4
view
& download paper
Authors: Gautam Patel of Teradyne and Jeff Shott
of Accelerant Networks
|
PDF
|
3.5M
|
| Press
Releases |
File
Type
|
Size
|
Rambus
and Teradyne To Demonstrate 10 Gbps Backplane Solution
at DesignCon East 2003
June 2003 |
HTML
|
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|
Vativ
and Teradyne Demonstrate 6.25 Gb/s Performance Across
60 Inches on FR-4 Backplane
May 2003 |
HTML
|
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Inventors
at Teradyne Connection Systems Receive 19 Patents
April 2003 |
HTML
|
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Teradyne
Connection Systems Introduces the VHDM L-Series
Connector; Provides Cost-Performance Optimized Solution
January 2003 |
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|
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Teradyne
Connection Systems Joins HSBI to Develop Specifications
for Interoperability at 5 Gb/s and Higher Speeds
October 2002 |
HTML
|
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Teradyne
and Accelerant Networks Deliver the Industry's First
6.25 Gb/s Backplane Reference Platform
July 2002
|
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|
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Teradyne,
Molex Launch Joint Website for VHDM-HSD Connectors
July 2002 |
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|
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|
Teradyne
Delivers Proven Performance and Reliability with
VHDM® and VHDM-HSD Connector Design for Manufacturability
(DFM)
June 2002
|
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|
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Teradyne
Delivers Proven Performance and Reliability with
VHDM® and VHDM-HSD Connector Design for Manufacturability
(DFM)
April 2002 |
HTML
|
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|
Teradyne
Connection Systems Introduces 6-Row Differential-Pair
Version of VHDM® Interconnect
January 2001 |
HTML
|
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|
Teradyne
Signs Molex Incorporated as Second-Source Producer
of High-Speed Interconnect
August 2000 |
HTML
|
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|
Teradyne
Introduces 5-Row Differential-Pair Version of VHDM
Interconnect
January 2000 |
HTML
|
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|
Teradyne's
New VHDM®-HSD Interconnect Optimized for Differential
Applications
June 1999 |
HTML
|
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| Drawings |
File
Type
|
Size
|
| VHDM-HSD
product drawings |
HTML
|
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|
| Technical
Bulletins |
File
Type
|
Size
|
| VHDM-HSD
technical bulletins |
HTML
|
--
|
| Tooling
& Repair Information |
File
Type
|
Size
|
| VHDM-HSD
tooling & repair information |
HTML
|
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|
