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XCede® Connector
 Designed for 20+ Gbps Performance
Amphenol’s XCede® connector platform is designed to enable future data rate
requirements of datacom, telecom, storage and wireless equipment:
- Ethernet
- SONET/SDH
- InfiniBand®
- PCI Express®
- HyperTransport™
- Fibre Channel
- SAS
- SATA
Highest Density To Meet Challenging Design Requirements
Offering today’s highest linear density of 82 differential pairs per inch, the XCede product
family meets the true high density needs of architectures with multiple front or
rear fabric slots and blade systems with cooling straight through the
backplane.
Broad Family of Interconnect Solutions
The XCede platform supports 2-Pair (27.5 differential pairs per
linear inch) through 6-Pair (82 differential pairs per linear inch)
connector sizes with complementary guidance, backplane and bus
bar power modules, and stacker, cable and coplanar interconnect
solutions.
High Performance
The XCede connector delivers the lowest crosstalk of any backplane connector available
today.
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| A unique 3-D resonance damping shield enables
very low crosstalk across a wide frequency
spectrum. |
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| Use of advanced engineering materials in the
shield eliminate crosstalk resonances, which
appear as ringing through multiple bit periods
in time-domain based measurements. |
Proven Reliability of Press-Fit Attachment
with Improved Impedance Performance
A new short compliant pin fits a 17.7mil finish hole size (0.55mm drill) and
allows deeper backdrilling and dual diameter vias to enhance the return loss
performance of the footprints. Midplanes with shared vias can also be thinner.
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| Optimized daughtercard and backplane footprints
each have two ground vias between differential
pairs, allowing elongated antipads and further
improving impedance. |
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Backplane modules feature
wide
rib-enhanced shield
contacts. |
Exceptional Robustness
The XCede backplane connector system provides
mechanical longevity and ruggedness required by
today’s systems. Wide shield contacts feature a stiffness
enhancing rib and are advanced well ahead of the signals
for “drag your finger across” robustness.
User Flexibility
Escape on all three sides of a connector
module with secondary routing channels
between the double ground vias in each
column. This flexibility can cut the number
of routing layers in half and help route
congested areas.
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| Routing out in two layers.
First layer shown in blue,
second layer shown in
red. |
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Double ground vias are spaced
1.56mm apart providing a wide
secondary routing channel. |
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| Unique daughtercard
construction minimizes skew
within any differential pair
simplifying board layout efforts
and minimizing common mode
noise. |
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US Patents 6,786,771 and 5,860,816. Additional patents pending.
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