XCede® Connector

Designed for 25 Gbps Performance
Amphenol’s XCede® connector platform is designed to enable future data rate requirements of datacom, telecom, storage and wireless equipment:

• Ethernet
• SONET/SDH
• InfiniBand®
• PCI Express®
• HyperTransport™
• Fibre Channel
• SAS
• SATA

The XCede connector family includes a broad range of components and application specific derivatives to provide complete solutions for your system requirements while meeting the IEEE 802.3ap v3.2 10GBASE-KR standard with margin.

• 85 and 100 ohm impedance - XCede provides designers with a readily available 85 Ohm solution without the challenges of retooling and requalification, in turn reducing the costs associated with meeting the latest specifications.
• XCede L-Series - Ideal for TTL sense and control and other low-speed data lines.
• Mezzanine Applications - The XCede Stacker enables parallel board to board designs with the same high levels of performance and reliability as the standard right angle version.
• Coplanar Applications - XCede Right Angle Male provides a custom right angle daughtercard with male pin assembled on a unique stiffener.
• Cable Connectors and Assemblies - Supporting cable designs ranging from 24 to 30 AWG, XCede cable connectors and assemblies are the ideal solution for front panel and backplane connections.

Highest Density To Meet Challenging Design Requirements
Offering today’s highest linear density of 82 differential pairs per inch, the XCede product family meets the true high density needs of architectures with multiple front or rear fabric slots and blade systems with cooling straight through the backplane.

Broad Family of Interconnect Solutions
The XCede platform supports 2-Pair (27.5 differential pairs per linear inch) through 6-Pair (82 differential pairs per linear inch) connector sizes with complementary guidance, backplane and bus bar power modules, and stacker, cable and coplanar interconnect solutions.

High Performance
The XCede connector delivers the lowest crosstalk of any backplane connector available today.

A unique 3-D resonance damping shield enables very low crosstalk across a wide frequency spectrum.

Use of advanced engineering materials in the shield eliminate crosstalk resonances, which appear as ringing through multiple bit periods in time-domain based measurements.

Proven Reliability of Press-Fit Attachment
with Improved Impedance Performance
Shorter backplane compliant pin fits a 17.7mil finish hole size (0.55mm drill) and allows deeper backdrilling and dual diameter vias to enhance the return loss performance of the footprints. Midplanes with shared vias can also be thinner. A new shorter compliant pin utilizes a 13.7mil finish hole size (0.45mm drill) for both daughtercard and backplane plated through holes.

Optimized daughtercard and backplane footprints each have two ground vias between differential pairs, allowing elongated antipads and further improving impedance.

Backplane modules feature wide rib-enhanced shield contacts.

Exceptional Robustness
The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness.

User Flexibility
Escape on all three sides of a connector module with secondary routing channels between the double ground vias in each column. This flexibility can cut the number of routing layers in half and help route congested areas.

Routing out in two layers. First layer shown in blue, second layer shown in red.

Double ground vias are spaced 1.56mm apart providing a wide secondary routing channel.

Unique daughtercard construction minimizes skew within any differential pair simplifying board layout efforts and minimizing common mode noise.

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US Patents 6,786,771 and 5,860,816. Additional patents pending.