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VHDM® Right-Angle Male FAQs
Electrical
Mechanical
Electrical
What is the current rating
of the signal pins?
1 amp
What is the current
rating of the shields?
2 amps
What is the contact resistance
between the compliant pin and the plated-through hole?
1 milliohm, maximum
What are the power options
for VHDM RAM connector?
Power modules are available that mate with the standard VHDM
daughtercard power module that are rated at 10 amps per blade
Mechanical
What is the per pin insertion/mating
force?
40 grams per signal and 40 grams per each beam on the backplane
shield
What is the normal force per
contact beam?
50 grams minimum per beam, end of life
How much wipe under load do I get with
high-speed?
1.05mm minimum with 4.25mm signal; 3mm minimum with 6.25mm
shield
How long can my daughtercard
connector assembly be before I need to split it and use a
joiner module?
Up to 304mm (12 inches) long.
Do I have to use end caps or
guide pins in my configuration?
End caps must be used in a connector pattern that does not
have power or guide modules at the ends. This is done in order
to cover up the exposed metal on the wafer. Guide pins are
strongly recommended at both ends, with a design guideline
of one guide module minimum for assemblies under 150mm (six
inches) long, and two guide modules for assemblies 150mm and
longer.
The daughtercard connector
is press-fit. Do I still need screws through my daughtercard?
Yes, for joiners and guide modules.
What is the minimum card-slot
pitch for the VHDM RAM connector?
Standard configuration is a 6-row module at 18mm
What are the minimum and maximum
printed circuit board thicknesses required for VHDM connectors?
0.070" (1,78mm) minimum. There really is no stated maximum
since the board fabricator is restricted by the manufacturing
aspect ratio for the daughtercard & backplane.
What spacing should
I use if I want to place a power connector beside a guide
module?
14mm between last pin on guide module and first pin on power
module.
If I am designing
a VHDM Right-Angle Male daughtercard, what multiples should
I design with?
Ideally we recommend that you remain in-line with the backplane
modules configurations, 10 and 25 positions, however it is
acceptable to mate a daughtercard with less wafers than a
backplane module if necessary.
What spacing
is recommended between power modules and signal wafers?
You should leave at least 2mm space between the power module
and signal wafers.
What
is the spacing grid on a daughtercard stiffener?
2mm
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