Amphenol's
NeXLev high-density parallel board connector is the
solution to meet increasing bandwidth demands in mezzanine
applications.
-
Performance — NeXLev handles data rates
up to 12 Gb/s.
- High-Density
— Single-ended: Up
to 57 real signals per linear centimeter (145 signals
per linear inch.) or differential: 29
differential pairs per linear centimeter (73
differential pairs per linear inch.)
- Reliability
— NeXLev features rugged wafer construction
and a compliant BGA-style attachment.
- Flexibility
— NeXLev allows you to partition your system
in different ways, optimizing performance while you
design for manufacturability.
Available Stacking Heights:
NeXLev is available in mated heights from 10-33mm; offered
in 100, 200, and 300 position modules.
|
|
Plug Height (mm) |
| |
|
2,5 |
4,5 |
6,5 |
9,5 |
Receptacle
Height
(mm) |
7,5 |
10 |
12 |
14 |
17* |
10,5 |
13 |
15 |
17 |
20* |
15,5 |
18 |
20 |
22 |
25* |
20,5 |
23 |
25 |
27 |
30* |
23,5 |
26 |
28 |
30 |
33* |
| |
*Contact factory for additional stack heights. |
Flexibility for optimized solutions
Today’s daughtercards can contain thousands of components, increasing
the potential for low production yields. NeXLev helps you alleviate
that risk by reducing the overall complexity of your cards.
Using NeXLev, you can relocate high pin count devices
onto a mezzanine or module card to simplify board
routing without compromising system performance.
This creates islands of high density for scalable
processing, memory modules, or interfacing I/O
cabling modules. Placing these high-density, high thermal
mass devices on a module also allows you to optimize your surface
mount processes, resulting in improved yields, and reduced overall
cost.
NeXLev not only improves the design of new systems, it can be used to upgrade
existing systems. Use it to plug in new high-featured mezzanine cards to an existing system or
add more processors or memory in the form of
module cards.
|
