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NeXLev®
Configuration
Receptacle | Plug
| Ball Grid Array
The NeXLev connector has been designed to be user-friendly.
The connector is a fully SMT connector utilizing ball grid technology
for termination to the board. Designed with solder joint reliability
in mind, the connector has a compliant structure and is readily
applied using standard SMT processes. Standard versions of the
NeXLev connector contain either 10, 20 or 30 wafers, with each
wafer containing 10 real signal contacts. This yields a usable
density of 100, 200 or 300 contacts per connector.
Available Stacking Heights:
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Plug Height (mm)
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Receptacle Height (mm)
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2,5
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4,5
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6,5
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| 7,5 |
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10
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12
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14
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| 10,5 |
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13
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15
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17
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| 15,5 |
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18
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20
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22
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| 23,5 |
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26
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28
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30
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NeXLev is available in mated heights from 10-30mm; offered in
100, 200, and 300 position modules.
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Receptacle
The receptacle is an array connector with 10 rows
of contacts provided in 100, 200, and 300-position housing.
The housing has a protected mating entry to prevent
contact stubbing. Design features in the ends of the
housings prevent mating the wrong wafers or the plug
connector 180 degrees out of orientation.
Available in 4 heights (7,5mm, 10,5mm, 15,5mm, and 23,5mm),
which combined with the plugs, provide a range of stacking
heights from 10 to 30mm.
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Plug
The 10 row signal wafer assembly is rugged and not
susceptible to bent leads. Side wall construction is
robust insuring the mechanical integrity of the connector.
Available in 3 heights (2,5mm, 4,5mm, and 6,5mm) which
combined with the receptacle's mating plug provides
stacking heights from 10 to 30mm.
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Ball Grid Array
Utilizing BGA attachment, NeXLev is unique in that the
solderballs are placed on the pedestal of a modified "S"
bend lead. This allows the solder joint to have compliancy,
a key contributor to long term solder joint reliability.
The effectiveness of this BGA attachment is documented
in the Solder Joint Reliability Report on the product
verification page. |
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* * *
Aptera, Crossbow, eHSD, GbX, HD Plus, HDM Plus, HDM, HD-Optyx, NeXLev, Ventura, VHDM, VHDM-HSD, XCede, Amphenol DesignLink, DesignLink and Amphenol are trademarks or registered trademarks of Amphenol Corporation.
All other product names are the marks of the respective owners.
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