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NeXLev®
Operating Characteristics
Materials and Finishes | Electrical | Mechanical
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| Materials
& Finishes |
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| Insulators |
Glass-reinforced polyester (Liquid Crystal
Polymer). UL 94V-0; color black or gray.
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| Signal Contacts |
0,15mm-thick copper alloy per
CDA 17110. 0,00127mm-thick nickel minimum all over per
QQ-N-290. 0,00076mm-thick gold minimum, selective in mating
area per MIL-G-45204, Type II, Grade C. 0,000076 to 0,0000127mm-thick
gold flash on ball attach foot.
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| Ball Grid Termination |
0,75mm dia. Eutectic 63/37 Sn-Pb.
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| Electrical |
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| Low-Level Contact Resistance |
20 milliohms maximum |
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Dielectric Withstanding
Voltage |
600 Megohms duty |
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| Insulation Resistance |
600 Megohms duty |
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| Signal Current Contact Rating |
1.0 A continuous duty** |
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| Shield Contact Current Ratings |
1.0 A continuous duty** |
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| Signal Integrity Targets* |
<5% crosstalk, <5% Vr @ *250
picosecond Tr, single-ended <5% crosstalk, <5% Vr @ 150
picosecond Tr, differential
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* These specifications apply
to the full range of heights 10-30mm
** Refer to T-Rise Report which is available in the product
verification section. |
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| Mechanical |
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| Wipe |
1,0mm minimum
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| Contact Normal Force |
0,35N (35 grams) minimum
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Contact Mating Force
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0,45N per signal. (300 I/O module
= 135N) (approximately 30 lb.)
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| Durability |
100 cycles, minimum
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NOTE: The above specifications are preliminary and
subject to change.
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* * *
Aptera, Crossbow, eHSD, GbX, HD Plus, HDM Plus, HDM, HD-Optyx, NeXLev, Ventura, VHDM, VHDM-HSD, XCede, Amphenol DesignLink, DesignLink and Amphenol are trademarks or registered trademarks of Amphenol Corporation.
All other product names are the marks of the respective owners.
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