| Design Formats |
| Cadence |
Mentor |
|
| PADS |
Zuken |
|
|
| Manufacturing Formats |
| ODB++ |
Autoplot |
DPF |
| DXF |
Excellon |
Gerber 274D |
| Gerber 274X |
HPGL |
IPC-D-356 |
|
| Maximum Panel Size |
| 24" x 54" (609.5mm x 1371.5mm) |
| 30" x 44" (762.0mm x 1117.5mm) |
| 36" x 42" (914.4mm x 1066.8mm) |
|
| Minimum Panel Size |
| 18" x 24" (457.2mm x 609.5mm) |
|
| Layer Count |
|
Interconnect
Formation Type |
| Back Drilled |
| Blind (laser & mechanical)* |
| Buried |
| Dual Diameter |
| Electrically Isolated |
| SMT |
| Thru Hole* |
| |
| *with conductive and non-conductive via fill |
|
| Aspect Ratio - Drilled Size |
| Compliant Holes > = 0.225 |
17:1 |
| Via Holes < .022 |
13:1 |
|
| Finished Hole Size |
| Compliant Pinned |
0.018" (0.457mm) |
| Via (A/R dependant) |
0.008" (0.203mm) |
| Buried Vias |
0.006" (0.152mm) |
Microvias
(up to 3 electrical layers) |
0.004" (0.101mm) |
|
Blind Via
Aspect Ratio |
|
| Internal Features |
| Lines |
0.003" (0.0762mm)
.5 oz. copper |
| Spacing |
0.003" (0.0762mm)
.5 oz. copper |
| Buried Resistors |
No |
| Buried Capacitance |
No |
Minimum Core
Thickness |
0.001" (0.0254mm) |
|
| External Features |
| Lines |
0.004" (0.1016mm)
.5 oz. copper |
| Spacing |
0.004" (0.1016mm)
.5 oz. copper |
|
| Materials |
| Low Tg FR4 (including phenolic cure) |
| High Tg FR4 (including phenolic cure) |
| Getek |
| Isola IS620 |
| Isola FR408 |
| Nelco 4000-13 |
| Nelco 4000-13 SI |
| Rogers 4350 |
| Rogers 4350/FR4 |
| Gore |
| Taconic |
| Polyimide |
| BT |
| Cyanate Ester |
| |
| Please contact Applications Engineering for the availability of additional materials |
|
| Copper Processing |
| 1/4 oz. - 10 oz. copper (U/L 7 oz.) |
|
Impedance
Single & Differential |
|
| Surface Finishes |
| Electrolytic Ni/Au |
ENIG |
| HASL |
Immersion Silver |
| Immersion Tin |
OSP-Entek 106 |
| Reflowed Tin/Lead |
|
|
| Certifications |
|
