Amphenol TCS

Amphenol TCS

Amphenol TCS

Amphenol TCS

Amphenol TCS

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Amphenol Printed Circuits Library
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Magazine Articles	File Type	Size
The Effects of LEAD-FREE on PCB Fabrication Printed Circuit Design & Manufacture Contributed Article by: Bob McGrath of Amphenol TCS	PDF	224KB
DFM: A Process to Provide Best Solutions CircuiTree, January 2004 Contributed Article by: Chris Rolfe and Dinis Anselmo of Amphenol TCS	HTML	--
Avoiding the Pressure: Bypass the soldering problems; compliant pin connectors are an effective alternative to surface mounting Printed Circuit Design - November 2002	PDF	205KB
White Papers	File Type	Size
Presented at DesignCon 2005 The Impact of PCB Laminate Weave on the Electrical Performance of Differential Signaling at Multi-Gigabit Data Rates view abstract \| request a copy	PDF	1.5M
International Cadence Usergroup Conference Deep Microvia's in Next Generation System Design view abstract \| request a copy	PDF	274KB
Presented at DesignCon 2003 Practical Guidelines for the implementation of back drilling plated through hole vias in multi-gigabit board applications view abstract \| request a copy	PDF	984KB
Presented at DesignCon 2003 Signal-Integrity Measurements Support the Candidacy of PTFE at High Data Rates view abstract \| request a copy	PDF	1.6M
Presented at DesignCon 1999 Signal Integrity Characterization of Printed Circuit Board Parameters view & download paper	PDF	1.9M
Press Releases	File Type	Size
Teradyne Connection Systems Makes Technology Investments in Printed Circuit Board Capabilities January 2005	HTML	--
Frost & Sullivan Honors Teradyne for Customer Value Enhancement in the Printed Circuit Boards Market July 2004	HTML	--
Teradyne High Performance Circuits Manufacturing Facility Achieves ISO 14001 Certifications January 2004	HTML	--
Rambus and Teradyne To Demonstrate 10 Gbps Backplane Solution at DesignCon East 2003 June 2003	HTML	--
Vativ and Teradyne Demonstrate 6.25 Gb/s Performance Across 60 Inches on FR-4 Backplane May 2003	HTML	--
Inventors at Teradyne Connection Systems Receive 19 Patents April 2003	HTML	--
Design Solutions, Inc. Opens Design Center at Teradyne Connection Systems; Provides High Performance Circuit Design Services April 2003	HTML	--
Teradyne Connection Systems to Offer Deep Micro-Via Solutions; Extends Technology Lead with Large Format High Performance Circuits February 2003	HTML	--
Teradyne to Provide High Performance Circuits to Kaparel Corporation for High-Speed Backplane Applications January 2003	HTML	--
Teradyne and Taconic Announce Joint Manufacturing Agreement; Alliance positions Taconic on the technology roadmap for high-speed digital applications March 2002	HTML	--

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