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Abstract
Advances in SMT Backplane Connectors
Presenters:
Phil Stokoe, Amphenol TCS
Burke Hunsaker, Amphenol TCS
Douglas Cannon, Amphenol TCS
With recent gains by semi-conductor manufacturers
resulting in the widespread availability of devices capable
of driving high-speed signals over longer printed circuit
board traces, system designers are presently considering product
designs that have data rates up to 25 Gb/s. This requirement
challenges the physical capabilities of further compliant
pin miniaturization.
The paper describes a significant
advancement in the development of surface mount backplane
connectors that meet industry standards of reliability and
reparability. The connector has a board footprint and via
structure that can meet the electrical performance needed
to satisfy future system requirements.
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