Amphenol TCS (ATCS): Advanced Design Techniques to Support Next Generation Backplane Links Beyond 10 Gbps

Home > Resource Center > White Papers > Abstract

Abstract

Advanced Design Techniques to Support Next Generation Backplane Links Beyond 10 Gbps

Authors:
Marc Cartier, Amphenol TCS
Jason Chan, Amphenol TCS
Tom Cohen, Amphenol TCS
Brian Kirk, Amphenol TCS

Copper backplane links are typically designed to support multiple generations of upgradeable plug-in modules with successive increases in line speed. Choices around cost, density, and risk must be made to facilitate this upgrade path, while maintaining cost effectiveness and reliability for the immediate market requirements. Progress is being made on various specifications for Ethernet, Fibre Channel, and other protocols that are expected to exceed 10 Gbps. Consequently, system designers are evaluating channels that support 20+ Gbps. This paper investigates advanced design techniques including alternative plated-through-structures (PTH) for connector attachment, advanced shielding technologies, and novel approaches to mitigate mode conversion effects.

Request a copy of this paper


		_______________________________________________________ ATCS site map ATCS Home \| ATCS Total System Solutions \| About ATCS \| Contact ATCS * * * Aptera, Crossbow, eHSD, GbX, HD Plus, HDM Plus, HDM, HD-Optyx, NeXLev, Ventura, VHDM, VHDM-HSD, XCede, Amphenol DesignLink, DesignLink and Amphenol are trademarks or registered trademarks of Amphenol Corporation. All other product names are the marks of the respective owners.