Abstract

Deep Microvias in Next Generation System Design

Authors:
Leigh Eichel
Marketing Manager, Amphenol TCS

Dave Anderson
PCB Technology Development Engineer, Amphenol TCS

This paper explores microvia use and benefits in system design. Microvias are typically defined as blind via interconnects in the range of 3 to 4 mils in diameter most commonly formed from the top and/or bottom layer(s) to the first or second adjacent internal layer. Normally the adjacent internal layers can be used to re-distribute the signals to other areas of the board where normal thru-hole vias can be used, they are commonly used as power/ground planes or a combination of both.

This paper will describe the possibilities that can be applied throughout your entire design from the use of deep microvias, including:

	Compared to traditional thru-hole vias, microvias can give HPC designers a distinct advantage in terms of overall board size reduction, layer count reduction and increased route or interconnect density.
	Getting all of your parts to fit on a specific board size is only half of the equation; completely routing all of the connections is the other half of the equation. Using microvias can allow you to reduce component-to-component spacing, which may lead to an overall reduction in board size or, reduce layer count by increasing the number of routing channels available on each layer.
	The amount of useable routing channels that can be gained by using microvias instead of thru-hole vias.