Abstract

Optimized Signal Path for Orthogonal System Architectures

Presenters:
Tom Cohen, Amphenol TCS
Brian Kirk, PhD, Signal Integrity Engineer, Amphenol TCS
Marc Cartier, Signal Integrity Engineer, Amphenol TCS

This paper will show examples of both traditional and advanced solutions to orthogonal midplane architectures with a description of mechanical, thermal, and electrical benefits/limitations. Most examples involve the use of backplane connectors that have been optimized around routing channels and densities for traditional backplane/card cage systems. Finally, the paper will describe a novel approach which involves a new interconnect system that is optimized for orthogonal implementation. By using new connector technologies, the resonance phenomenon of the plated through hole is mitigated. Consequently, these developments remove the need for back drilling operations or complex circuit board technologies. The resulting system is an improved performance, reduced cost, orthogonal architecture.