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White Papers

Recent Amphenol TCS white papers are available upon request. Please select from the list and complete the short form below. A copy of the white paper you requested will be forwarded to your email account shortly. In addition, Amphenol TCS provides a number of past white papers for immediate download. Simply click on the "Download Now" button to view and save a copy to your desktop.

Date	Title	Request a Copy
January 2008	DesignCon 2008 Performance Limitations of Backplane Links at 6 Gbps and Above (view abstract)	Request a Copy
January 2007	DesignCon 2007 Advanced Design Techniques to Support Next Generation Backplane Links Beyond 10Gbps (view abstract)	Request a Copy
February 2006	DesignCon 2006 Practical Design Considerations for 10 to 25 Gbps Copper Backplane Serial Links (view abstract)	Request a Copy
February 2006	DesignCon 2006 Advances in SMT Backplane Connectors (view abstract)
February 2005	DesignCon 2005 Optimized Signal Path for Orthogonal System Architectures (view abstract) Authors: Tom Cohen, Amphenol TCS Brian Kirk, Amphenol TCS Marc Cartier, Amphenol TCS
February 2005	DesignCon 2005 The Impact of PCB Laminate Weave on the Electrical Performance of Differential Signaling at Multi-Gigabit Data Rates (view abstract) Authors: Scott McMorrow, Teraspeed Consulting Group Chris Heard, Amphenol TCS
September 2003	International Cadence Usergroup Deep Microvias in Next Generation System Design (view abstract) Authors: Leigh Eichel, Amphenol TCS Dave Anderson, Amphenol TCS
January 2003	DesignCon 2003 Practical Guidelines for the implementation of back drilling plated through holes vias in multi-gigabit board applications (view abstract) Author: Tom Cohen, Amphenol TCS
January 2003	DesignCon 2003 Connector and Chip Vendors Unite to Produce a High-Performance 10 Gb/s NRZ-Capable Serial Backplane (view abstract) Authors: Gautam Patel, Amphenol TCS Matt Shafer, Xilinx, Inc. Bodhi Das, Xilinx, Inc.
January 2003	DesignCon 2003 Signal Integrity Measurements Support the Candidacy of PTFE at High Data Rates (view abstract) Authors: Meagan Morrell, Amphenol TCS Thomas McCarthy, Taconic

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The following white papers are available for immediate download. Click on "Download Now" to view and save to your desktop. .........................................................................
Date	Title
October 2002	Electronica 2002 Designing 3.125 Gbps Backplane Systems Authors: Gautam Patel, Teradyne Kevin Ryan, Teradyne	7.8M PDF
	IEC On-Line Tutorial Signal Integrity - Multi-Gigabit Transmission over Backplane Systems Authors: Marc Cartier, Teradyne Tom Cohen, Teradyne Gautam Patel, Teradyne	HTML
January 2002	DesignCon 2002 Overcoming Design Challenges to Reach 1 Tbps Bandwidth for a Star Configuration Backplane Using FR4 Authors: Gautam Patel, Teradyne Tom Shott, Accelerant Networks	3.5M PDF
January 2001	DesignCon 2001 Signal Integrity Considerations for 10 Gb/s Transmission Over Backplane Systems Authors: Marc Cartier, Teradyne Tom Cohen, Teradyne Gautam Patel, Teradyne Jeff Smith, AMCC	1.6M PDF
January 2001	DesignCon 2001 2.5 Gbps Backplane Design, Simulation, and Measurement Authors: Gautam Patel, Teradyne John Goldie, National Semiconductor	7.6M PDF
January 2001	DesignCon 2001 Using Creative Silicon Technology to Extend the Useful Life of Backplane and Card Substrates at 3.125 Gbps and Beyond Authors: Rober Cutler, Teradyne Paul Galloway, Velio Kevin Roselle, Velio	1.1M PDF
January 2000	DesignCon 2001 Design Considerations for Gigabit Backplane Systems Authors: Tom Cohen, Teradyne Katie Rothstein, Teradyne	716KB PDF
January 1999	DesignCon 1999 Signal Integrity Characterization of Printed Circuit Board Parameters Authors: Gautam Patel, Teradyne Katie Rothstein, Teradyne	2.0M PDF
January 1998	DesignCon 1998 High-Speed Board and Interconnect Considerations Authors: Tom Cohen, Teradyne Gautam Patel, Teradyne	529KB PDF
1998	IMAPS Signal Integrity Considerations for High Speed Data Transmission in a Printed Circuit Board System Authors: Tom Cohen, Teradyne Gautam Patel, Teradyne Katie Rothstein, Teradyne	438KB PDF
1997	IMAPS Revolutionary High Performance Interconnect Which Maximizes Signal Density Authors: Tom Cohen, Teradyne Gautam Patel, Teradyne	347KB PDF


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