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Driving faster and faster serial data rates over copper backplanes is a challenge, given that as speed increases, so do losses, dispersion, and crosstalk.
Last Updated: May 28, 2008
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628KB
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CopperCAD Design's User Guide for AGen_Backdrill, a SKILL program add-in to Allegro that automatically generates backdrill files.
Last Updated: June 2, 2008
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152KB
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DesignCon 2005 - Laminate Weave impact on Er, loss tangent, and propagation delay.
Last Updated: June 2, 2008
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1MB
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DesignCon 2003 - A growing need is developing in the high speed digital arena for high performance laminate, prepreg materials, connectors, intelligent routing of differential pairs, and other...
Last Updated: February 9, 2009
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2MB
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September 2003 - This paper explores microvia use and benefits in system design. Microvias are typically defined as blind via interconnects in the range of 3 to 4 mils in diameter.
Last Updated: June 2, 2008
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273KB
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Last Updated: July 3, 2008
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323KB
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Last Updated: July 3, 2008
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91KB
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Last Updated: July 3, 2008
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49KB
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Last Updated: February 16, 2012
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71KB
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Last Updated: July 3, 2008
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70KB
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